Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 1-4173 Thermally Conductive Adhesive

Dow DOWSIL 1-4173 Thermally Conductive Adhesive is a silicone-based, one-component paste offering excellent thermal conductivity (1.5 W/m·K), low thermal resistance, and strong adhesion to metals, plastics, and ceramics. It cures at room temperature with moisture, provides electrical insulation, and withstands -40°C to 200°C. Ideal for bonding heat sinks, LEDs, and power electronics.
  • dow dowsil 1 4173 thermally conductive adhesive_ae6b1531
  • dow dowsil 1 4173 thermally conductive adhesive_ae6b1531

Features Of Dow DOWSIL 1-4173 Thermally Conductive Adhesive

  1. High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.

  2. Low modulus silicone formulation enables stress relief and accommodates coefficient of thermal expansion (CTE) mismatches.

  3. Room-temperature cure with optional heat acceleration, supporting flexible manufacturing integration.

  4. Excellent adhesion to common substrates including aluminum, copper, ceramics, and FR-4 PCBs without primers.

  5. UL 94 V-0 rated for flame resistance, meeting critical safety requirements in power electronics.

Typical Applications Of Dow DOWSIL 1-4173 Thermally Conductive Adhesive

  1. Thermal interface bonding of IGBT modules and power semiconductor packages to heat sinks.

  2. Attachment of LED packages and drivers in high-brightness lighting systems.

  3. Die attach and heat sink bonding in automotive ADAS and onboard chargers.

  4. Thermal management of 5G RF power amplifiers and base station components.

  5. Permanent bonding of sensors and control units in industrial motor drives.

Specifications Of Dow DOWSIL 1-4173 Thermally Conductive Adhesive

Chemical TypeFiller-loaded addition-cure silicone adhesive
Product FormTwo-component paste (Part A: silver-filled base; Part B: platinum catalyst)
AppearanceGray, non-sag paste
Primary ApplicationsStructural thermal interface material (TIM) for power electronics
Key FeaturesThermally conductive, electrically insulating, low-stress, flame retardant
BenefitsReduces thermal resistance, improves reliability, eliminates mechanical fasteners, supports automated dispensing
Cure Schedule (Standard)24 h at 25°C or 60 min at 80°C
Shelf Life (Unopened)6 months at ≤25°C (refrigerated storage recommended for extended stability)


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