High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation enables stress relief and accommodates coefficient of thermal expansion (CTE) mismatches.
Room-temperature cure with optional heat acceleration, supporting flexible manufacturing integration.
Excellent adhesion to common substrates including aluminum, copper, ceramics, and FR-4 PCBs without primers.
UL 94 V-0 rated for flame resistance, meeting critical safety requirements in power electronics.
Thermal interface bonding of IGBT modules and power semiconductor packages to heat sinks.
Attachment of LED packages and drivers in high-brightness lighting systems.
Die attach and heat sink bonding in automotive ADAS and onboard chargers.
Thermal management of 5G RF power amplifiers and base station components.
Permanent bonding of sensors and control units in industrial motor drives.
| Chemical Type | Filler-loaded addition-cure silicone adhesive |
| Product Form | Two-component paste (Part A: silver-filled base; Part B: platinum catalyst) |
| Appearance | Gray, non-sag paste |
| Primary Applications | Structural thermal interface material (TIM) for power electronics |
| Key Features | Thermally conductive, electrically insulating, low-stress, flame retardant |
| Benefits | Reduces thermal resistance, improves reliability, eliminates mechanical fasteners, supports automated dispensing |
| Cure Schedule (Standard) | 24 h at 25°C or 60 min at 80°C |
| Shelf Life (Unopened) | 6 months at ≤25°C (refrigerated storage recommended for extended stability) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China