Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOW CORNING TORAY DA 6523 Adhesive

Dow DOW CORNING TORAY DA 6523 Adhesive is a high-performance silicone-based structural adhesive designed for bonding glass, metals, and composites in demanding automotive and architectural applications. It offers excellent thermal stability, UV resistance, and rapid room-temperature cure with strong, flexible bonds and superior adhesion to low-surface-energy substrates.
  • dow dow corning toray da 6523 adhesive_8568368e
  • dow dow corning toray da 6523 adhesive_8568368e

Features Of Dow DOW CORNING TORAY DA 6523 Adhesive

  1. High-performance silicone-based adhesive offering excellent thermal stability across –60 °C to +200 °C.

  2. Low modulus formulation provides superior stress relief for bonded assemblies subjected to thermal cycling or vibration.

  3. Excellent adhesion to diverse substrates including metals, glass, ceramics, and engineered plastics without primer.

  4. Room-temperature vulcanizing (RTV) system with fast tack-free time and controllable cure profile.

  5. UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical electronic applications.

Typical Applications Of Dow DOW CORNING TORAY DA 6523 Adhesive

  1. Bonding and sealing of power electronics modules, including IGBTs and inverters.

  2. Attachment of heat sinks and thermal interface components in LED lighting systems.

  3. Structural bonding of sensors and actuators in automotive under-hood environments.

  4. Die-attach and housing sealing for industrial control enclosures exposed to humidity and temperature extremes.

  5. Assembly of medical diagnostic devices requiring biocompatibility-compliant materials (ISO 10993 tested).

Specifications Of Dow DOW CORNING TORAY DA 6523 Adhesive

Chemical TypeCondensation-cure silicone elastomer
Product FormTwo-part paste (Part A: base, Part B: catalyst)
AppearanceOpaque gray paste (Part A), translucent amber liquid (Part B)
Primary ApplicationsStructural bonding, thermal management, environmental sealing
Key FeaturesLow modulus, RTV cure, high elongation (>150%), low shrinkage
BenefitsReduces thermal stress, extends product lifetime, simplifies assembly process
Cure MechanismMoisture-cured at room temperature; accelerated with elevated humidity or mild heat
Shelf Life (unopened)12 months at 25 °C in original sealed packaging


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