High-performance silicone-based adhesive offering excellent thermal stability across –60 °C to +200 °C.
Low modulus formulation provides superior stress relief for bonded assemblies subjected to thermal cycling or vibration.
Excellent adhesion to diverse substrates including metals, glass, ceramics, and engineered plastics without primer.
Room-temperature vulcanizing (RTV) system with fast tack-free time and controllable cure profile.
UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical electronic applications.
Bonding and sealing of power electronics modules, including IGBTs and inverters.
Attachment of heat sinks and thermal interface components in LED lighting systems.
Structural bonding of sensors and actuators in automotive under-hood environments.
Die-attach and housing sealing for industrial control enclosures exposed to humidity and temperature extremes.
Assembly of medical diagnostic devices requiring biocompatibility-compliant materials (ISO 10993 tested).
| Chemical Type | Condensation-cure silicone elastomer |
| Product Form | Two-part paste (Part A: base, Part B: catalyst) |
| Appearance | Opaque gray paste (Part A), translucent amber liquid (Part B) |
| Primary Applications | Structural bonding, thermal management, environmental sealing |
| Key Features | Low modulus, RTV cure, high elongation (>150%), low shrinkage |
| Benefits | Reduces thermal stress, extends product lifetime, simplifies assembly process |
| Cure Mechanism | Moisture-cured at room temperature; accelerated with elevated humidity or mild heat |
| Shelf Life (unopened) | 12 months at 25 °C in original sealed packaging |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China