High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates including plastics, glass, and metals.
Offers outstanding thermal stability across a wide operating temperature range from –55 °C to +200 °C.
Low modulus formulation provides superior stress relief and resistance to thermal cycling-induced failure.
UL 94 HB flammability rating and RoHS-compliant formulation for regulated industrial environments.
Non-corrosive cure chemistry—releases methanol instead of acetic acid—making it safe for sensitive electronic components and optics.
LED lighting assembly—including lens bonding, heat sink attachment, and housing sealing.
Automotive electronics—such as sensor encapsulation, control unit potting, and display module lamination.
Consumer electronics—used for camera module bonding, wearable device gasketing, and flexible circuit fixation.
Industrial sensors and instrumentation requiring long-term reliability under vibration and thermal shock.
Medical device assembly where biocompatibility-adjacent materials and low outgassing are critical.
| Chemical Type | One-part, condensation-cure, methyl-terminated silicone polymer |
| Product Form | Paste (thixotropic, non-sag) |
| Appearance | Opaque white to off-white paste |
| Primary Applications | Structural bonding, sealing, and gasketing in electronics and automotive |
| Key Features | Low modulus, non-corrosive cure, excellent adhesion to untreated plastics |
| Benefits | Reduces stress on fragile components; enables high-yield automated dispensing |
| Cure Mechanism | Moisture-cured at room temperature (full cure: 7 days @ 23 °C / 50% RH) |
| Shelf Life | 9 months unopened in original sealed container at ≤25 °C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China