Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL EA-7100 Silicone Adhesive

Dow DOWSIL EA-7100 Silicone Adhesive is a high-performance, two-part addition-cure silicone offering excellent adhesion to plastics, metals, and glass. It delivers low modulus, thermal stability from –55°C to 200°C, and UL 94 V-0 flammability rating. Ideal for electronics encapsulation and automotive sensor bonding.
  • dow dowsil ea 7100 silicone adhesive_97b36b36
  • dow dowsil ea 7100 silicone adhesive_97b36b36

Features Of Dow DOWSIL EA-7100 Silicone Adhesive

  1. High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates including plastics, glass, and metals.

  2. Offers outstanding thermal stability across a wide operating temperature range from –55 °C to +200 °C.

  3. Low modulus formulation provides superior stress relief and resistance to thermal cycling-induced failure.

  4. UL 94 HB flammability rating and RoHS-compliant formulation for regulated industrial environments.

  5. Non-corrosive cure chemistry—releases methanol instead of acetic acid—making it safe for sensitive electronic components and optics.

Typical Applications Of Dow DOWSIL EA-7100 Silicone Adhesive

  1. LED lighting assembly—including lens bonding, heat sink attachment, and housing sealing.

  2. Automotive electronics—such as sensor encapsulation, control unit potting, and display module lamination.

  3. Consumer electronics—used for camera module bonding, wearable device gasketing, and flexible circuit fixation.

  4. Industrial sensors and instrumentation requiring long-term reliability under vibration and thermal shock.

  5. Medical device assembly where biocompatibility-adjacent materials and low outgassing are critical.

Specifications Of Dow DOWSIL EA-7100 Silicone Adhesive

Chemical TypeOne-part, condensation-cure, methyl-terminated silicone polymer
Product FormPaste (thixotropic, non-sag)
AppearanceOpaque white to off-white paste
Primary ApplicationsStructural bonding, sealing, and gasketing in electronics and automotive
Key FeaturesLow modulus, non-corrosive cure, excellent adhesion to untreated plastics
BenefitsReduces stress on fragile components; enables high-yield automated dispensing
Cure MechanismMoisture-cured at room temperature (full cure: 7 days @ 23 °C / 50% RH)
Shelf Life9 months unopened in original sealed container at ≤25 °C


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