High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates including plastics, glass, and metals.
Offers outstanding thermal stability across a wide operating temperature range from –55 °C to +200 °C.
Low modulus formulation provides superior stress relief and resistance to thermal cycling-induced failure.
UL 94 HB flammability rating and RoHS-compliant formulation for regulated industrial environments.
Non-corrosive cure chemistry—releases methanol instead of acetic acid—making it safe for sensitive electronic components and optics.
LED lighting assembly—including lens bonding, heat sink attachment, and housing sealing.
Automotive electronics—such as sensor encapsulation, control unit potting, and display module lamination.
Consumer electronics—used for camera module bonding, wearable device gasketing, and flexible circuit fixation.
Industrial sensors and instrumentation requiring long-term reliability under vibration and thermal shock.
Medical device assembly where biocompatibility-adjacent materials and low outgassing are critical.
| Chemical Type | One-part, condensation-cure, methyl-terminated silicone polymer |
| Product Form | Paste (thixotropic, non-sag) |
| Appearance | Opaque white to off-white paste |
| Primary Applications | Structural bonding, sealing, and gasketing in electronics and automotive |
| Key Features | Low modulus, non-corrosive cure, excellent adhesion to untreated plastics |
| Benefits | Reduces stress on fragile components; enables high-yield automated dispensing |
| Cure Mechanism | Moisture-cured at room temperature (full cure: 7 days @ 23 °C / 50% RH) |
| Shelf Life | 9 months unopened in original sealed container at ≤25 °C |
Q1: What substrates does DOWSIL EA-7100 bond well to?
A: DOWSIL EA-7100 exhibits strong adhesion to a broad range of substrates including glass, aluminum, stainless steel, polycarbonate, and other engineering thermoplastics. Performance may vary depending on surface cleanliness, pretreatment, and cure conditions.
Q2: How is DOWSIL EA-7100 typically cured?
A: This adhesive cures at room temperature via moisture-cure chemistry, with full property development occurring over several days depending on thickness and humidity. Elevated temperatures (e.g., 40–60 °C) can accelerate the cure process without compromising final performance.
Q3: Is DOWSIL EA-7100 suitable for applications requiring flexibility and thermal stability?
A: Yes — as a silicone-based adhesive, it retains elasticity across a wide temperature range and demonstrates excellent resistance to thermal cycling, UV exposure, and environmental aging, making it well-suited for dynamic or outdoor assemblies.
Q4: Can DOWSIL EA-7100 be used in conjunction with other Dow silicone products?
A: It is generally compatible with many Dow silicone sealants, coatings, and encapsulants; however, compatibility testing under actual application conditions is recommended to ensure interfacial adhesion and long-term performance.
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