Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

DOW DOWSIL 1-4173 Thermally Conductive Silicone Adhesive

DOW DOWSIL 1-4173 Thermally Conductive Silicone Adhesive is a high-performance, one-component silicone paste offering excellent thermal conductivity (1.5 W/m·K), low thermal resistance, and strong adhesion to metals, plastics, and ceramics. It cures at room temperature with moisture, delivers long-term reliability under thermal cycling, and resists aging, vibration, and humidity—ideal for bonding, sealing, and heat dissipation in electronics and EV power modules.
  • dow dowsil 1 4173 thermally conductive silicone adhesive_b7eaaf6b
  • dow dowsil 1 4173 thermally conductive silicone adhesive_b7eaaf6b

Features Of DOW DOWSIL 1-4173 Thermally Conductive Silicone Adhesive

  1. High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.

  2. Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.

  3. Room-temperature vulcanizing (RTV) with tack-free time of approximately 30 minutes and full cure in 24 hours at 25°C/50% RH.

  4. UL 94 V-0 rated for flame resistance, supporting safety-compliant designs in power electronics and EV systems.

  5. Excellent adhesion to metals, ceramics, and common engineering plastics without primers.

Typical Applications Of DOW DOWSIL 1-4173 Thermally Conductive Silicone Adhesive

  1. Thermal interface bonding of IGBT modules, power inverters, and battery management systems (BMS) in electric vehicles.

  2. Die-attach and heat sink attachment in high-power LED lighting and solid-state lighting (SSL) fixtures.

  3. Thermal bonding of sensors, controllers, and DC-DC converters in industrial automation equipment.

  4. Attachment of heat spreaders and cold plates in telecom base station power amplifiers and 5G infrastructure.

Specifications Of DOW DOWSIL 1-4173 Thermally Conductive Silicone Adhesive

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormPaste, two-component (Part A + Part B)
AppearanceGray, homogeneous paste
Primary ApplicationsStructural thermal bonding and gap-filling in power electronics
Key FeaturesThermally conductive, electrically insulating, low modulus, RTV
BenefitsReduces interfacial thermal resistance, accommodates CTE mismatch, enables simplified assembly
Cure SystemAddition cure (no by-products)
Storage Stability12 months at ≤25°C in unopened containers


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