High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.
Room-temperature vulcanizing (RTV) with tack-free time of approximately 30 minutes and full cure in 24 hours at 25°C/50% RH.
UL 94 V-0 rated for flame resistance, supporting safety-compliant designs in power electronics and EV systems.
Excellent adhesion to metals, ceramics, and common engineering plastics without primers.
Thermal interface bonding of IGBT modules, power inverters, and battery management systems (BMS) in electric vehicles.
Die-attach and heat sink attachment in high-power LED lighting and solid-state lighting (SSL) fixtures.
Thermal bonding of sensors, controllers, and DC-DC converters in industrial automation equipment.
Attachment of heat spreaders and cold plates in telecom base station power amplifiers and 5G infrastructure.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Paste, two-component (Part A + Part B) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Structural thermal bonding and gap-filling in power electronics |
| Key Features | Thermally conductive, electrically insulating, low modulus, RTV |
| Benefits | Reduces interfacial thermal resistance, accommodates CTE mismatch, enables simplified assembly |
| Cure System | Addition cure (no by-products) |
| Storage Stability | 12 months at ≤25°C in unopened containers |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China