Name: Dow DOWSIL 1-4174 Thermally Conductive Adhesive
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of Dow DOWSIL 1-4174 Thermally Conductive Adhesive

High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in compact electronic assemblies.
Room-temperature cure with optional heat acceleration, enabling flexible manufacturing integration.
Low modulus elastomeric formulation that accommodates coefficient of thermal expansion (CTE) mismatch between substrates.
Excellent adhesion to common electronics substrates including aluminum, copper, ceramics, and FR-4 PCBs.
UL 94 V-0 rated for flame retardancy, supporting safety compliance in power electronics applications.

Typical Applications Of Dow DOWSIL 1-4174 Thermally Conductive Adhesive

Thermal interface bonding of IGBT modules and power semiconductor packages to heat sinks.
Attachment of LED packages and COB (chip-on-board) arrays in high-brightness lighting systems.
Die attach and thermal management for automotive ADAS sensors and onboard chargers.
Structural thermal bonding in 5G base station RF power amplifiers and mmWave antenna modules.

Chemical Type	Heat-curable silicone adhesive with thermally conductive filler
Product Form	Paste (thixotropic, dispensable via syringe or jetting)
Appearance	Gray, uniform paste
Primary Applications	Thermal interface material (TIM) for structural bonding and heat transfer
Key Features	Electrically insulating, low stress, UL 94 V-0 rated
Benefits	Reduces thermal resistance, eliminates need for secondary mechanical fasteners, supports automated assembly
Cure Schedule (Typical)	24 hrs at 25°C or 60 min at 100°C
Storage Condition	Refrigerated at 2–8°C; stable for 12 months unopened

Get in Touch with ERICW

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E-mail: wangxingqiang@ericwchem.com
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15921782326
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China