Name: Dow DOWSIL 3-4207 Dielectric Tough Gel Kit
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of Dow DOWSIL 3-4207 Dielectric Tough Gel Kit

Ultra-low modulus silicone gel formulation that remains soft and compliant after cure—minimizing mechanical stress on delicate electronic components.
Excellent dielectric insulation properties with high volume resistivity (>1 × 10¹⁴ Ω·cm) and low dielectric loss across wide temperature and frequency ranges.
Two-part, platinum-catalyzed system offering room-temperature or elevated-temperature cure flexibility with no by-products.
Outstanding long-term thermal stability—maintains integrity from –50 °C to +200 °C without cracking, pumping out, or hardening.
Non-corrosive, halogen-free, and RoHS-compliant formulation suitable for sensitive optoelectronic and aerospace assemblies.

Typical Applications Of Dow DOWSIL 3-4207 Dielectric Tough Gel Kit

Encapsulation and protection of high-voltage power electronics, including IGBT modules and inverters.
Dielectric filling for LED lighting systems requiring thermal management and electrical isolation.
Stress-relieving potting of MEMS sensors, optical transceivers, and fine-pitch semiconductor packages.
Gap-filling under heat sinks and between PCBs in automotive ADAS and battery management systems (BMS).
Insulating coating for flexible printed circuits (FPCs) and conformal protection of 5G RF front-end modules.

Chemical Type	Platinum-cured addition-cure silicone gel
Product Form	Two-component kit (Part A: base; Part B: catalyst)
Appearance	Translucent, viscous liquid (Part A); colorless to pale yellow liquid (Part B)
Mix Ratio by Weight	10:1 (A:B)
Cure Schedule (Typical)	24 h at 25 °C or 2 h at 80 °C
Hardness (Shore 00)	10–15 (ASTM D2240)
Density (g/cm³)	1.08–1.12 (25 °C, ASTM D1475)
Primary Applications	Dielectric encapsulation, stress relief, thermal interface filling

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