Two-component, room-temperature curing epoxy system with excellent adhesion to metals, composites, and thermosets.
High shear and peel strength retention after thermal aging up to 120 °C.
Low viscosity formulation enables precise dispensing and gap-filling in complex assemblies.
Halogen-free chemistry compliant with RoHS and REACH regulatory requirements.
Controlled pot life of approximately 60–90 minutes at 23 °C for flexible production scheduling.
Aerospace structural bonding of aluminum and carbon fiber reinforced polymer (CFRP) components.
Electronics encapsulation and die attachment in high-reliability power modules.
Automotive sensor mounting and battery module assembly requiring thermal stability.
Industrial machinery bonding where resistance to vibration and thermal cycling is critical.
Wind turbine blade root and spar cap bonding in composite manufacturing.
| Chemical Type | Bisphenol-F based epoxy resin with amine hardener |
| Product Form | Two-component liquid system (Resin + Hardener) |
| Appearance (Mixed) | Amber, translucent liquid |
| Mix Ratio by Weight | 100 : 35 (Resin : Hardener) |
| Cure Schedule (Standard) | 24 h at 23 °C or 2 h at 80 °C |
| Density (23 °C, mixed) | 1.18–1.22 g/cm³ |
| Primary Applications | Structural bonding, composite assembly, electronics encapsulation |
| Key Features | Room-temperature cure, halogen-free, low shrinkage, high Tg (~115 °C) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China