Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Solvay BR 127 Epoxy Adhesive

Solvay BR 127 Epoxy Adhesive is a high-performance, two-component structural adhesive from Solvay’s BR series, engineered for aerospace and automotive applications. It delivers exceptional peel strength, thermal stability up to 180°C, low outgassing, and excellent adhesion to composites, metals, and thermosets without surface pretreatment.
  • solvay br 127 epoxy adhesive_fd1f7e2a
  • solvay br 127 epoxy adhesive_fd1f7e2a

Features Of Solvay BR 127 Epoxy Adhesive

  1. Two-component, room-temperature curing epoxy system with excellent adhesion to metals, composites, and thermosets.

  2. High shear and peel strength retention after thermal aging up to 120 °C.

  3. Low viscosity formulation enables precise dispensing and gap-filling in complex assemblies.

  4. Halogen-free chemistry compliant with RoHS and REACH regulatory requirements.

  5. Controlled pot life of approximately 60–90 minutes at 23 °C for flexible production scheduling.

Typical Applications Of Solvay BR 127 Epoxy Adhesive

  1. Aerospace structural bonding of aluminum and carbon fiber reinforced polymer (CFRP) components.

  2. Electronics encapsulation and die attachment in high-reliability power modules.

  3. Automotive sensor mounting and battery module assembly requiring thermal stability.

  4. Industrial machinery bonding where resistance to vibration and thermal cycling is critical.

  5. Wind turbine blade root and spar cap bonding in composite manufacturing.

Specifications Of Solvay BR 127 Epoxy Adhesive

Chemical TypeBisphenol-F based epoxy resin with amine hardener
Product FormTwo-component liquid system (Resin + Hardener)
Appearance (Mixed)Amber, translucent liquid
Mix Ratio by Weight100 : 35 (Resin : Hardener)
Cure Schedule (Standard)24 h at 23 °C or 2 h at 80 °C
Density (23 °C, mixed)1.18–1.22 g/cm³
Primary ApplicationsStructural bonding, composite assembly, electronics encapsulation
Key FeaturesRoom-temperature cure, halogen-free, low shrinkage, high Tg (~115 °C)


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