Non-corrosive, fluorosilicone-based formulation compatible with sensitive electronic components and elastomeric seals.
Excellent dielectric stability across wide temperature range (−55 °C to +200 °C) with low dielectric loss.
Thixotropic gel consistency ensures no sagging or migration after application, even on vertical surfaces.
UL 94 V-0 rated for flame resistance, supporting safety-critical electrical insulation requirements.
Low outgassing profile per ASTM E595, making it suitable for vacuum and aerospace-grade environments.
High-voltage connector and terminal potting in electric vehicle (EV) powertrain systems.
Insulation and moisture protection for aerospace avionics junction boxes and sensor interfaces.
Dielectric filling of high-frequency RF modules and 5G base station power amplifiers.
Thermal interface and electrical isolation in industrial LED drivers and solid-state relays.
Sealing and dielectric encapsulation of medical imaging equipment high-voltage cables and connectors.
| Chemical Type | Fluorosilicone-based dielectric gel |
| Product Form | Two-part kit (Part A: base gel; Part B: platinum-cure catalyst) |
| Appearance | Opaque off-white viscous gel (uncured); translucent amber after cure |
| Primary Applications | Electrical insulation, environmental sealing, and dielectric filling |
| Key Features | Non-corrosive, thixotropic, UL 94 V-0 rated, low-outgassing |
| Benefits | Long-term reliability under thermal cycling, no pump-out, excellent adhesion to plastics/metals |
| Cure System | Platinum-catalyzed addition cure at room temperature or accelerated with mild heat |
| Shelf Life | 12 months unopened at 5–25 °C (refrigerated storage recommended for Part B) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China