One-component, moisture-curing silicone adhesive offering excellent adhesion to challenging substrates including plastics, metals, and painted surfaces.
Low modulus formulation provides high flexibility and superior stress relief for assemblies subject to thermal cycling or vibration.
Non-corrosive cure chemistry—acetoxy-free—making it safe for use with sensitive electronic components and copper-containing materials.
Good resistance to weathering, UV exposure, and temperature extremes from –40 °C to +150 °C after full cure.
White pigmented, paste-like consistency enables easy dispensing and controlled application without sagging on vertical surfaces.
Automotive lighting assembly—including headlamp and taillamp sealing and lens bonding.
Electronics encapsulation and structural bonding of housings, sensors, and control units.
Appliance manufacturing for gasketing, trim attachment, and panel bonding in white goods.
Architectural glazing and façade component bonding where flexibility and long-term durability are required.
Industrial equipment assembly requiring vibration-damping adhesion and environmental resistance.
| Chemical Type | Acetoxy-cure silicone elastomer |
| Product Form | Paste (thixotropic) |
| Appearance | White, uniform paste |
| Primary Applications | Structural bonding, sealing, and gasketing |
| Key Features | Low modulus, non-corrosive cure, UV stable, flexible |
| Shelf Life (unopened) | 12 months at ≤25 °C in original sealed container |
| Cure Mechanism | Moisture-curing (ambient humidity) |
| Operating Temperature Range | –40 °C to +150 °C (after full cure) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China