Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SH 9555 W C Silicone Adhesive

Dow DOWSIL SH 9555 W C Silicone Adhesive is a one-component, moisture-curing, white silicone sealant offering excellent adhesion to glass, aluminum, and plastics. It delivers low modulus elasticity, superior weather resistance, and UL 94 HB flame retardancy—ideal for architectural glazing and solar panel assembly in demanding environments.
  • dow dowsil sh 9555 w c silicone adhesive_012361a1
  • dow dowsil sh 9555 w c silicone adhesive_012361a1

Features Of Dow DOWSIL SH 9555 W C Silicone Adhesive

  1. One-component, moisture-curing silicone adhesive offering excellent adhesion to challenging substrates including plastics, metals, and painted surfaces.

  2. Low modulus formulation provides high flexibility and superior stress relief for assemblies subject to thermal cycling or vibration.

  3. Non-corrosive cure chemistry—acetoxy-free—making it safe for use with sensitive electronic components and copper-containing materials.

  4. Good resistance to weathering, UV exposure, and temperature extremes from –40 °C to +150 °C after full cure.

  5. White pigmented, paste-like consistency enables easy dispensing and controlled application without sagging on vertical surfaces.

Typical Applications Of Dow DOWSIL SH 9555 W C Silicone Adhesive

  1. Automotive lighting assembly—including headlamp and taillamp sealing and lens bonding.

  2. Electronics encapsulation and structural bonding of housings, sensors, and control units.

  3. Appliance manufacturing for gasketing, trim attachment, and panel bonding in white goods.

  4. Architectural glazing and façade component bonding where flexibility and long-term durability are required.

  5. Industrial equipment assembly requiring vibration-damping adhesion and environmental resistance.

Specifications Of Dow DOWSIL SH 9555 W C Silicone Adhesive

Chemical TypeAcetoxy-cure silicone elastomer
Product FormPaste (thixotropic)
AppearanceWhite, uniform paste
Primary ApplicationsStructural bonding, sealing, and gasketing
Key FeaturesLow modulus, non-corrosive cure, UV stable, flexible
Shelf Life (unopened)12 months at ≤25 °C in original sealed container
Cure MechanismMoisture-curing (ambient humidity)
Operating Temperature Range–40 °C to +150 °C (after full cure)


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *