High-performance, two-component epoxy adhesive system designed for structural bonding in demanding industrial environments.
Excellent resistance to thermal cycling, humidity, and chemical exposure including hydrocarbons and aviation fluids.
Low-viscosity formulation enables precise dispensing and superior gap-filling capability up to 0.5 mm.
Room-temperature cure profile with optional elevated-temperature post-cure for enhanced Tg and mechanical properties.
Meets ASTM D3433 for structural adhesive classification and supports OEM qualification protocols in aerospace and transportation.
Aerospace interior components bonding (e.g., panels, trim, overhead bins).
Rail vehicle assembly, including composite-to-metal bonding of interior structures.
Industrial machinery housing and sensor mounting where vibration damping and long-term stability are critical.
Electronics enclosures requiring EMI-shielding compatibility and low outgassing performance.
Wind energy applications for non-structural bonding of blade fairings and auxiliary components.
| Chemical Type | Bisphenol-F based epoxy resin system with amine hardener |
| Product Form | Two-component liquid (Part A: resin, Part B: hardener) |
| Appearance | Part A: amber liquid; Part B: pale yellow liquid |
| Mix Ratio (by weight) | 100 : 30 (A:B) |
| Working Life (23°C) | ≥ 90 minutes after mixing |
| Full Cure (23°C) | 7 days (or 2 hours at 80°C + 24 hours ambient) |
| Primary Applications | Structural bonding of composites, metals, and thermoset plastics |
| Key Features | Low chloride content, RoHS compliant, halogen-free |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China