Two-component, solvent-free silicone gel system offering excellent thermal conductivity and low modulus for stress-sensitive assemblies.
Self-leveling and non-slumping behavior ensures consistent gap-filling across irregular surfaces and varying bond line thicknesses.
Ultra-low compression force required—ideal for delicate components such as ceramic substrates, thin heat spreaders, and fragile semiconductor packages.
Excellent long-term stability with minimal pump-out or phase separation under thermal cycling (−40 °C to 150 °C).
Room-temperature cure capability with optional accelerated cure at elevated temperatures for high-throughput manufacturing.
Thermal interface material (TIM) between power electronics modules (e.g., IGBTs, SiC MOSFETs) and cold plates in electric vehicles and renewable energy inverters.
Die-attach and heat dissipation solution for high-brightness LEDs and laser diodes in automotive lighting and industrial sensing systems.
Gap-filling thermal management for 5G base station RF power amplifiers and millimeter-wave antenna modules.
Interface material for AI accelerator chips and high-performance computing (HPC) GPUs where mechanical compliance and reliability are critical.
| Chemical Type | Platinum-cured addition-cure silicone gel |
| Product Form | Two-part kit (Part A + Part B), supplied separately in cartridges or bulk containers |
| Appearance | Opaque gray gel (Part A); translucent amber gel (Part B) |
| Primary Applications | Thermal interface material for power electronics, LED lighting, and telecom hardware |
| Key Features | Non-slumping, self-leveling, ultra-low modulus, no solvent, no volatile byproducts |
| Benefits | Reduces mechanical stress on solder joints and brittle die, improves thermal cycling reliability |
| Cure System | Room temperature cure (7 days) or accelerated cure (30 min at 100 °C) |
| Shelf Life | 12 months at ≤25 °C unopened; refrigerated storage recommended for extended stability |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China