High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates.
Outstanding resistance to thermal cycling, UV exposure, and environmental aging without loss of flexibility.
Low modulus formulation provides superior stress relief for bonded assemblies subjected to vibration or differential thermal expansion.
Non-corrosive cure chemistry—acetoxy-free—making it safe for sensitive electronic components and metals.
Good flow and gap-filling capability, enabling reliable bonding on uneven or slightly porous surfaces.
Automotive lighting assemblies, including headlamp and taillamp sealing and lens bonding.
Electronics encapsulation and structural bonding in LED modules and power supplies.
Industrial appliance gasketing and trim attachment where long-term weatherability is critical.
Architectural glazing and façade component bonding in commercial building applications.
Medical device housing assembly requiring biocompatibility-compliant materials (ISO 10993 tested).
| Chemical Type | One-part, moisture-curing, addition-cure inhibited silicone adhesive |
| Product Form | Paste, thixotropic, cartridge-ready |
| Appearance | Opaque white to off-white paste |
| Primary Applications | Structural bonding, sealing, and gasketing in automotive, electronics, and industrial markets |
| Key Features | Low modulus, non-corrosive cure, excellent adhesion to plastics and metals |
| Benefits | Reduced assembly stress, extended service life under thermal cycling, no post-cure required |
| Cure Mechanism | Moisture-cured at ambient temperature |
| Shelf Life (Unopened) | 12 months at ≤25 °C in original sealed packaging |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China