Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

DOW DOWSIL 3-1598 HP Silicone Adhesive

DOW DOWSIL 3-1598 HP Silicone Adhesive is a high-performance, two-part platinum-cured silicone offering excellent adhesion to metals, plastics and glass. It delivers superior thermal stability (-60°C to 200°C), low compression set and outstanding electrical insulation. Ideal for demanding automotive, aerospace and electronics bonding applications requiring long-term reliability and precision dispensing.
  • dow dowsil 3 1598 hp silicone adhesive_21cc1043
  • dow dowsil 3 1598 hp silicone adhesive_21cc1043

Features Of DOW DOWSIL 3-1598 HP Silicone Adhesive

  1. High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates.

  2. Outstanding resistance to thermal cycling, UV exposure, and environmental aging without loss of flexibility.

  3. Low modulus formulation provides superior stress relief for bonded assemblies subjected to vibration or differential thermal expansion.

  4. Non-corrosive cure chemistry—acetoxy-free—making it safe for sensitive electronic components and metals.

  5. Good flow and gap-filling capability, enabling reliable bonding on uneven or slightly porous surfaces.

Typical Applications Of DOW DOWSIL 3-1598 HP Silicone Adhesive

  1. Automotive lighting assemblies, including headlamp and taillamp sealing and lens bonding.

  2. Electronics encapsulation and structural bonding in LED modules and power supplies.

  3. Industrial appliance gasketing and trim attachment where long-term weatherability is critical.

  4. Architectural glazing and façade component bonding in commercial building applications.

  5. Medical device housing assembly requiring biocompatibility-compliant materials (ISO 10993 tested).

Specifications Of DOW DOWSIL 3-1598 HP Silicone Adhesive

Chemical TypeOne-part, moisture-curing, addition-cure inhibited silicone adhesive
Product FormPaste, thixotropic, cartridge-ready
AppearanceOpaque white to off-white paste
Primary ApplicationsStructural bonding, sealing, and gasketing in automotive, electronics, and industrial markets
Key FeaturesLow modulus, non-corrosive cure, excellent adhesion to plastics and metals
BenefitsReduced assembly stress, extended service life under thermal cycling, no post-cure required
Cure MechanismMoisture-cured at ambient temperature
Shelf Life (Unopened)12 months at ≤25 °C in original sealed packaging


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