Ultra-low modulus silicone gel formulation for stress-free encapsulation of sensitive electronic components.
Excellent dielectric strength and volume resistivity, ensuring reliable electrical insulation under high-voltage conditions.
Thermally stable across a wide operating range (–50 °C to +200 °C) with minimal thermal expansion or shrinkage.
Non-corrosive and halogen-free, compatible with copper, aluminum, gold, and common PCB substrates.
Self-healing surface and tack-free after cure, enabling clean handling and long-term interfacial integrity.
High-voltage power electronics: IGBT modules, EV inverter assemblies, and onboard chargers.
LED lighting systems requiring thermal management and electrical isolation for COB and high-lumen packages.
Sensors and MEMS devices where mechanical damping and environmental protection are critical.
Renewable energy inverters and photovoltaic junction boxes exposed to outdoor thermal cycling and humidity.
Medical imaging equipment electronics needing biocompatibility-compliant, low-stress potting solutions.
| Chemical Type | Platinum-cured methylvinylsiloxane-based silicone gel |
| Product Form | Two-part liquid (Part A: base, Part B: catalyst), mix ratio 10:1 by weight |
| Appearance | Translucent, viscous liquid (Part A); colorless to pale yellow liquid (Part B) |
| Primary Applications | Dielectric encapsulation, conformal coating, and stress-relieving potting of high-reliability electronics |
| Key Features | Ultra-soft gel (Shore 00 hardness <10), non-slumping, room-temperature or elevated-temperature cure |
| Benefits | Eliminates thermal and mechanical stress, prevents moisture ingress, and maintains long-term bond integrity |
| Cure System | Pt-catalyzed addition cure; full cure at 25 °C in 7 days or 1 hr at 100 °C |
| UL Recognition | UL 94 V-0 rated (per cured sample, 3.2 mm thickness) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China