Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-6635 Dielectric Gel

Dow DOWSIL 3-6635 Dielectric Gel is a silicone-based thermal interface material offering ultra-low modulus high conformability and excellent dielectric insulation. It remains stable across −40°C to 200°C resists pump-out and provides long-term reliability in power electronics LED modules and EV battery systems. Non-corrosive non-toxic and easy to dispense.
  • dow dowsil 3 6635 dielectric gel_3c77f858
  • dow dowsil 3 6635 dielectric gel_3c77f858

Features Of Dow DOWSIL 3-6635 Dielectric Gel

  1. Ultra-low modulus silicone gel formulation for stress-free encapsulation of sensitive electronic components.

  2. Excellent dielectric strength and volume resistivity, ensuring reliable electrical insulation under high-voltage conditions.

  3. Thermally stable across a wide operating range (–50 °C to +200 °C) with minimal thermal expansion or shrinkage.

  4. Non-corrosive and halogen-free, compatible with copper, aluminum, gold, and common PCB substrates.

  5. Self-healing surface and tack-free after cure, enabling clean handling and long-term interfacial integrity.

Typical Applications Of Dow DOWSIL 3-6635 Dielectric Gel

  1. High-voltage power electronics: IGBT modules, EV inverter assemblies, and onboard chargers.

  2. LED lighting systems requiring thermal management and electrical isolation for COB and high-lumen packages.

  3. Sensors and MEMS devices where mechanical damping and environmental protection are critical.

  4. Renewable energy inverters and photovoltaic junction boxes exposed to outdoor thermal cycling and humidity.

  5. Medical imaging equipment electronics needing biocompatibility-compliant, low-stress potting solutions.

Specifications Of Dow DOWSIL 3-6635 Dielectric Gel

Chemical TypePlatinum-cured methylvinylsiloxane-based silicone gel
Product FormTwo-part liquid (Part A: base, Part B: catalyst), mix ratio 10:1 by weight
AppearanceTranslucent, viscous liquid (Part A); colorless to pale yellow liquid (Part B)
Primary ApplicationsDielectric encapsulation, conformal coating, and stress-relieving potting of high-reliability electronics
Key FeaturesUltra-soft gel (Shore 00 hardness <10), non-slumping, room-temperature or elevated-temperature cure
BenefitsEliminates thermal and mechanical stress, prevents moisture ingress, and maintains long-term bond integrity
Cure SystemPt-catalyzed addition cure; full cure at 25 °C in 7 days or 1 hr at 100 °C
UL RecognitionUL 94 V-0 rated (per cured sample, 3.2 mm thickness)


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