Ultra-low modulus formulation for exceptional stress relief in thermally cycled LED and power electronics assemblies.
Excellent long-term reliability under high humidity and elevated temperature conditions (e.g., 85°C/85% RH).
Fast room-temperature cure with optional heat acceleration, enabling high-throughput manufacturing.
Outstanding adhesion to common substrates including FR-4, aluminum, copper, and plastic housings without primers.
Halogen-free and RoHS-compliant formulation supporting environmentally responsible electronics manufacturing.
Encapsulation of high-brightness LED modules for outdoor lighting and automotive headlamps.
Protection of power semiconductor devices such as IGBTs, MOSFETs, and SiC modules in inverters and converters.
Underfill and edge-sealing for large-area PCBs in renewable energy systems (e.g., solar microinverters).
Conformal protection of sensitive sensors and control units in harsh industrial environments.
Thermal interface and mechanical stabilization for battery management system (BMS) electronics.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-component liquid (Part A + Part B) |
| Appearance | Translucent, low-viscosity liquid (Part A); translucent, low-viscosity liquid (Part B) |
| Primary Applications | LED encapsulation, power electronics protection, sensor sealing |
| Key Features | Low modulus, halogen-free, moisture-resistant, primerless adhesion |
| Benefits | Reduced thermal stress, extended device lifetime, simplified processing, compliance-ready |
| Cure System | Room-temperature cure (7 days) or accelerated cure (1 hr at 100°C) |
| Storage Stability | 12 months at ≤25°C in unopened containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China