Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 1880 Silicone Encapsulant

Dow DOWSIL SE 1880 is a high-performance silicone encapsulant offering excellent thermal stability, low stress, and superior moisture resistance. Designed for LED and power electronics protection, it cures rapidly at room temperature or with mild heat. Its low viscosity ensures precise dispensing and void-free coverage while maintaining long-term reliability under harsh conditions.
  • dow dowsil se 1880 silicone encapsulant_c2b2c62f
  • dow dowsil se 1880 silicone encapsulant_c2b2c62f

Features Of Dow DOWSIL SE 1880 Silicone Encapsulant

  1. Ultra-low modulus formulation for exceptional stress relief in thermally cycled LED and power electronics assemblies.

  2. Excellent long-term reliability under high humidity and elevated temperature conditions (e.g., 85°C/85% RH).

  3. Fast room-temperature cure with optional heat acceleration, enabling high-throughput manufacturing.

  4. Outstanding adhesion to common substrates including FR-4, aluminum, copper, and plastic housings without primers.

  5. Halogen-free and RoHS-compliant formulation supporting environmentally responsible electronics manufacturing.

Typical Applications Of Dow DOWSIL SE 1880 Silicone Encapsulant

  1. Encapsulation of high-brightness LED modules for outdoor lighting and automotive headlamps.

  2. Protection of power semiconductor devices such as IGBTs, MOSFETs, and SiC modules in inverters and converters.

  3. Underfill and edge-sealing for large-area PCBs in renewable energy systems (e.g., solar microinverters).

  4. Conformal protection of sensitive sensors and control units in harsh industrial environments.

  5. Thermal interface and mechanical stabilization for battery management system (BMS) electronics.

Specifications Of Dow DOWSIL SE 1880 Silicone Encapsulant

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormTwo-component liquid (Part A + Part B)
AppearanceTranslucent, low-viscosity liquid (Part A); translucent, low-viscosity liquid (Part B)
Primary ApplicationsLED encapsulation, power electronics protection, sensor sealing
Key FeaturesLow modulus, halogen-free, moisture-resistant, primerless adhesion
BenefitsReduced thermal stress, extended device lifetime, simplified processing, compliance-ready
Cure SystemRoom-temperature cure (7 days) or accelerated cure (1 hr at 100°C)
Storage Stability12 months at ≤25°C in unopened containers


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *