Two-part, platinum-cured silicone gel system offering ultra-low modulus and exceptional conformability for delicate electronic components.
Self-healing properties enable recovery after mechanical stress, maintaining long-term protection and interface integrity.
Non-corrosive formulation with low ionic impurities, suitable for high-reliability applications in aerospace and medical electronics.
Room-temperature or elevated-temperature cure options provide processing flexibility without compromising gel performance.
Excellent thermal stability over -50 °C to +200 °C continuous service range with minimal compression set.
Thermal interface material (TIM) for power modules, IGBTs, and LED assemblies.
Encapsulation and cushioning of sensitive sensors, MEMS devices, and flexible printed circuits (FPCs).
Die-attach and underfill replacement in miniaturized automotive electronics and ADAS systems.
Conformal coating alternative for irregular surfaces requiring zero-stress mechanical protection.
Protection of battery management system (BMS) components in EV and energy storage applications.
| Chemical Type | Platinum-cured addition-cure silicone gel |
| Product Form | Two-component kit (Part A: base; Part B: catalyst) |
| Appearance | Translucent, viscous liquid (Part A); translucent, low-viscosity liquid (Part B) |
| Mix Ratio by Weight | 10:1 (A:B) |
| Cure Mechanism | Platinum-catalyzed hydrosilylation |
| Shore A Hardness (Cured) | 5–10 |
| Density (25 °C) | Approx. 1.15 g/cm³ |
| Primary Applications | Thermal management, stress-relief encapsulation, and protective potting |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China