Two-part, room-temperature curing silicone adhesive system engineered for high thermal conductivity and reliable bond integrity.
Non-sag formulation enables precise dispensing and vertical surface application without slumping or migration.
Excellent adhesion to diverse substrates including aluminum, copper, stainless steel, ceramics, and common engineering plastics.
UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical electronic assemblies.
Low modulus design accommodates thermal cycling stress, minimizing risk of delamination or component damage over time.
Thermal interface bonding of power electronics modules (e.g., IGBTs, MOSFETs) to heat sinks in EV inverters and onboard chargers.
Attachment of LED packages and COB arrays to metal-core PCBs (MCPCBs) in high-brightness lighting systems.
Structural thermal bonding of battery cell monitoring units (BMUs) and busbar connections in lithium-ion battery packs.
Die-attach and heat spreader fixation in industrial motor drives and renewable energy converters.
| Chemical Type | Two-part addition-cure silicone |
| Product Form | Kit (Part A: gray paste; Part B: black paste) |
| Appearance | Opaque, homogeneous pastes — no visible phase separation |
| Primary Applications | Thermal management bonding in power electronics and LED systems |
| Key Features | Thermally conductive, electrically insulating, flame retardant (UL 94 V-0) |
| Benefits | Room-temperature cure, low stress, long pot life (>4 hours at 25°C), non-corrosive |
| Cure Schedule (Typical) | 24 hours at 25°C or 2 hours at 80°C for full cure |
| Thermal Conductivity (ASTM D5470) | 1.5 W/m·K (measured at 25°C, 1 MPa contact pressure) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China