Two-part, room-temperature curing silicone adhesive system engineered for high thermal conductivity and reliable bond integrity.
Non-sag formulation enables precise dispensing and vertical surface application without slumping or migration.
Excellent adhesion to diverse substrates including aluminum, copper, stainless steel, ceramics, and common engineering plastics.
UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical electronic assemblies.
Low modulus design accommodates thermal cycling stress, minimizing risk of delamination or component damage over time.
Thermal interface bonding of power electronics modules (e.g., IGBTs, MOSFETs) to heat sinks in EV inverters and onboard chargers.
Attachment of LED packages and COB arrays to metal-core PCBs (MCPCBs) in high-brightness lighting systems.
Structural thermal bonding of battery cell monitoring units (BMUs) and busbar connections in lithium-ion battery packs.
Die-attach and heat spreader fixation in industrial motor drives and renewable energy converters.
| Chemical Type | Two-part addition-cure silicone |
| Product Form | Kit (Part A: gray paste; Part B: black paste) |
| Appearance | Opaque, homogeneous pastes — no visible phase separation |
| Primary Applications | Thermal management bonding in power electronics and LED systems |
| Key Features | Thermally conductive, electrically insulating, flame retardant (UL 94 V-0) |
| Benefits | Room-temperature cure, low stress, long pot life (>4 hours at 25°C), non-corrosive |
| Cure Schedule (Typical) | 24 hours at 25°C or 2 hours at 80°C for full cure |
| Thermal Conductivity (ASTM D5470) | 1.5 W/m·K (measured at 25°C, 1 MPa contact pressure) |
Q1: What is the primary function of the DOWSIL 3-6753 kit in thermal management applications?
A: The DOWSIL 3-6753 kit is a two-part silicone-based adhesive system engineered to bond and thermally interface heat-generating components—such as power modules, LEDs, or sensors—to heat sinks or cold plates. It provides simultaneous structural adhesion and efficient heat transfer while maintaining flexibility and long-term reliability under thermal cycling.
Q2: How does the mixed viscosity and pot life of DOWSIL 3-6753 support common dispensing methods?
A: After mixing Part A and Part B at the specified ratio, the resulting compound exhibits a medium-viscosity paste suitable for automated dispensing, syringe application, or stencil printing. Its pot life allows sufficient working time for precise placement before onset of cure, supporting consistent process control in high-volume assembly environments.
Q3: Is DOWSIL 3-6753 compatible with common electronic substrates and coatings?
A: Yes, it adheres well to a broad range of materials used in electronics—including aluminum, copper, stainless steel, ceramics, and many molded plastics—without requiring primers. It also demonstrates good compatibility with conformal coatings applied post-cure, though compatibility testing under end-use conditions is recommended.
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E-mail: wangxingqiang@ericwchem.com
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