Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-6753 Thermally Conductive Adhesive Kit

Dow DOWSIL 3-6753 is a two-part thermally conductive adhesive kit engineered for high-reliability bonding and heat dissipation in electronics. Featuring low thermal resistance, excellent dielectric properties, and robust adhesion to metals/ceramics, it cures at room temperature or accelerated with mild heat. Ideal for EV battery modules, power electronics, and LED assemblies requiring long-term thermal management stability.
  • dow dowsil 3 6753 thermally conductive adhesive kit_5e2bf8cb
  • dow dowsil 3 6753 thermally conductive adhesive kit_5e2bf8cb

Features Of Dow DOWSIL 3-6753 Thermally Conductive Adhesive Kit

  1. Two-part, room-temperature curing silicone adhesive system engineered for high thermal conductivity and reliable bond integrity.

  2. Non-sag formulation enables precise dispensing and vertical surface application without slumping or migration.

  3. Excellent adhesion to diverse substrates including aluminum, copper, stainless steel, ceramics, and common engineering plastics.

  4. UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical electronic assemblies.

  5. Low modulus design accommodates thermal cycling stress, minimizing risk of delamination or component damage over time.

Typical Applications Of Dow DOWSIL 3-6753 Thermally Conductive Adhesive Kit

  1. Thermal interface bonding of power electronics modules (e.g., IGBTs, MOSFETs) to heat sinks in EV inverters and onboard chargers.

  2. Attachment of LED packages and COB arrays to metal-core PCBs (MCPCBs) in high-brightness lighting systems.

  3. Structural thermal bonding of battery cell monitoring units (BMUs) and busbar connections in lithium-ion battery packs.

  4. Die-attach and heat spreader fixation in industrial motor drives and renewable energy converters.

Specifications Of Dow DOWSIL 3-6753 Thermally Conductive Adhesive Kit

Chemical TypeTwo-part addition-cure silicone
Product FormKit (Part A: gray paste; Part B: black paste)
AppearanceOpaque, homogeneous pastes — no visible phase separation
Primary ApplicationsThermal management bonding in power electronics and LED systems
Key FeaturesThermally conductive, electrically insulating, flame retardant (UL 94 V-0)
BenefitsRoom-temperature cure, low stress, long pot life (>4 hours at 25°C), non-corrosive
Cure Schedule (Typical)24 hours at 25°C or 2 hours at 80°C for full cure
Thermal Conductivity (ASTM D5470)1.5 W/m·K (measured at 25°C, 1 MPa contact pressure)


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