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High-purity grade with ≥99.9% assay, ensuring consistent reactivity in polymer synthesis.
Low residual acetone and phenol content, minimizing side reactions during epoxy resin production.
Excellent thermal stability, supporting high-temperature processing without premature degradation.
Strictly controlled heavy metal impurities (Pb, As, Hg < 1 ppm), meeting global food-contact and electronics-grade requirements.
Batch-to-batch reproducibility certified per ISO 9001 manufacturing protocols.
Epoxy resins for electrical laminates and printed circuit board (PCB) substrates.
Polycarbonate plastics used in optical lenses, automotive components, and medical devices.
High-performance coatings for industrial tanks, pipelines, and marine applications.
Flame-retardant additives in engineering thermoplastics and composite matrices.
Adhesives and sealants requiring high adhesion strength and chemical resistance.
| Chemical Type | Bisphenol A (4,4'-Isopropylidenediphenol) |
| Product Form | White crystalline powder |
| Appearance | Free-flowing, odorless granular solid |
| Melting Point | 158–160 °C |
| Assay (by HPLC) | ≥99.9% |
| Residual Acetone | ≤50 ppm |
| Residual Phenol | ≤100 ppm |
| Heavy Metals (as Pb) | <1 ppm |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
