Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-1598 HP Adhesive

Dow DOWSIL 3-1598 HP Adhesive is a high-performance, two-part silicone adhesive sealant offering exceptional thermal stability, electrical insulation, and adhesion to diverse substrates including metals, plastics, and ceramics. It cures at room temperature with low shrinkage, delivering reliable bonding for demanding industrial, automotive, and electronics applications where durability and precision matter.
  • dow dowsil 3 1598 hp adhesive_1e90abcd
  • dow dowsil 3 1598 hp adhesive_1e90abcd

Features Of Dow DOWSIL 3-1598 HP Adhesive

  1. High-performance, two-part silicone adhesive offering exceptional thermal stability from –60 °C to +200 °C.

  2. Excellent adhesion to challenging substrates including metals, glass, ceramics, and engineered plastics without primers.

  3. Low modulus formulation provides superior stress relief and resistance to thermal cycling fatigue.

  4. UL 94 V-0 rated for flame retardancy, supporting compliance in demanding electronic and transportation applications.

  5. Low volatile organic compound (VOC) content and RoHS-compliant formulation for environmentally responsible manufacturing.

Typical Applications Of Dow DOWSIL 3-1598 HP Adhesive

  1. LED lighting assembly — bonding heat sinks, lenses, and metal housings.

  2. Automotive power electronics — attaching IGBT modules, sensors, and battery management components.

  3. Aerospace avionics enclosures — sealing and bonding vibration-sensitive assemblies requiring long-term reliability.

  4. Industrial power supplies — structural bonding of transformers, capacitors, and busbars exposed to thermal cycling.

  5. Medical diagnostic equipment — bonding critical subassemblies where biocompatibility and outgassing control are essential.

Specifications Of Dow DOWSIL 3-1598 HP Adhesive

Chemical TypeTwo-part addition-cure silicone
Product FormPaste (Part A and Part B supplied separately)
AppearanceOpaque gray (Part A), opaque black (Part B)
Primary ApplicationsStructural bonding, thermal interface, and environmental sealing in high-reliability electronics
Key FeaturesHigh thermal stability, low modulus, primerless adhesion, UL 94 V-0 rating
BenefitsReduced assembly complexity, extended service life under thermal cycling, improved safety compliance
Cure SystemPlatinum-catalyzed addition cure at elevated temperature (e.g., 125 °C for 60 min)
Storage Stability≥12 months at ≤25 °C (unopened containers)


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