High thermal conductivity for efficient heat dissipation in demanding electronic assemblies.
Room-temperature curing silicone adhesive with excellent long-term stability and reliability.
Low modulus formulation minimizes stress on temperature-sensitive components during thermal cycling.
Electrically insulating to prevent short circuits while maintaining robust thermal performance.
Good adhesion to a wide range of substrates including metals, ceramics, and engineered plastics.
Attachment of power semiconductors (e.g., IGBTs, MOSFETs) to heat sinks in power electronics.
Bonding LED modules and drivers in high-brightness lighting systems.
Thermal interface bonding in automotive ADAS and infotainment control units.
Die attachment and heat sink bonding in industrial motor drives and inverters.
Thermally conductive structural bonding in renewable energy inverters and battery management systems.
| Chemical Type | Room-Temperature Vulcanizing (RTV) Silicone |
| Product Form | Two-component paste (Part A + Part B) |
| Appearance | Off-white, viscous paste |
| Primary Applications | Structural thermal bonding and heat sink attachment |
| Key Features | Electrically insulating, low modulus, thermally conductive |
| Benefits | Reduces thermal resistance, accommodates CTE mismatch, enables simplified assembly |
| Cure Mechanism | Condensation cure at room temperature (accelerated with mild heat) |
| Storage Stability | 12 months unopened at 5–25°C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China