Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-1818 Thermally Conductive Adhesive

Dow DOWSIL 3-1818 Thermally Conductive Adhesive is a silicone-based, one-component paste offering excellent thermal conductivity (1.8 W/m·K), low modulus, and room-temperature curing. Ideal for bonding heat sinks, LEDs, and power electronics, it provides electrical insulation, shock absorption, and long-term reliability across wide temperature ranges.
  • dow dowsil 3 1818 thermally conductive adhesive_ceddef23
  • dow dowsil 3 1818 thermally conductive adhesive_ceddef23

Features Of Dow DOWSIL 3-1818 Thermally Conductive Adhesive

  1. High thermal conductivity for efficient heat dissipation in demanding electronic assemblies.

  2. Room-temperature curing silicone adhesive with excellent long-term stability and reliability.

  3. Low modulus formulation minimizes stress on temperature-sensitive components during thermal cycling.

  4. Electrically insulating to prevent short circuits while maintaining robust thermal performance.

  5. Good adhesion to a wide range of substrates including metals, ceramics, and engineered plastics.

Typical Applications Of Dow DOWSIL 3-1818 Thermally Conductive Adhesive

  1. Attachment of power semiconductors (e.g., IGBTs, MOSFETs) to heat sinks in power electronics.

  2. Bonding LED modules and drivers in high-brightness lighting systems.

  3. Thermal interface bonding in automotive ADAS and infotainment control units.

  4. Die attachment and heat sink bonding in industrial motor drives and inverters.

  5. Thermally conductive structural bonding in renewable energy inverters and battery management systems.

Specifications Of Dow DOWSIL 3-1818 Thermally Conductive Adhesive

Chemical TypeRoom-Temperature Vulcanizing (RTV) Silicone
Product FormTwo-component paste (Part A + Part B)
AppearanceOff-white, viscous paste
Primary ApplicationsStructural thermal bonding and heat sink attachment
Key FeaturesElectrically insulating, low modulus, thermally conductive
BenefitsReduces thermal resistance, accommodates CTE mismatch, enables simplified assembly
Cure MechanismCondensation cure at room temperature (accelerated with mild heat)
Storage Stability12 months unopened at 5–25°C


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *