Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-4155 HV Dielectric Gel Kit

Dow DOWSIL 3-4155 HV Dielectric Gel Kit is a high-voltage silicone-based insulating gel system designed for potting, encapsulation, and thermal management in demanding electrical applications. It offers excellent dielectric strength, thermal stability, low shrinkage, and long-term reliability under harsh conditions. The two-component kit cures at room temperature or accelerated with heat.
  • dow dowsil 3 4155 hv dielectric gel kit_6e2ca130
  • dow dowsil 3 4155 hv dielectric gel kit_6e2ca130

Features Of Dow DOWSIL 3-4155 HV Dielectric Gel Kit

  1. High-voltage dielectric stability up to 30 kV/mm, ensuring reliable electrical insulation under demanding conditions.

  2. Non-corrosive, platinum-catalyzed silicone gel formulation compatible with sensitive electronic components and metals.

  3. Low modulus and excellent conformability for stress-free encapsulation of irregular geometries and fine-pitch assemblies.

  4. Thermally stable from –50 °C to +200 °C, maintaining dielectric integrity across wide operating temperature ranges.

  5. Ready-to-use two-part kit (Part A + Part B) with precise 1:1 mix ratio by volume for consistent processing and reproducible performance.

Typical Applications Of Dow DOWSIL 3-4155 HV Dielectric Gel Kit

  1. High-voltage power electronics encapsulation, including inverters, converters, and EV traction inverters.

  2. Dielectric filling and potting of medium- and high-voltage sensors, busbar connections, and switchgear components.

  3. Insulation protection for renewable energy systems such as solar string combiners and wind turbine power modules.

  4. Underfill and gap-filling in industrial motor drives and uninterruptible power supply (UPS) systems.

  5. Protection of high-density PCBs and power semiconductor modules subject to thermal cycling and partial discharge.

Specifications Of Dow DOWSIL 3-4155 HV Dielectric Gel Kit

Chemical TypePlatinum-catalyzed addition-cure silicone gel
Product FormTwo-component liquid kit (Part A and Part B)
Appearance (Mixed)Translucent, viscous gel
Mix Ratio (by Volume)1:1 (A:B)
Cure MechanismRoom-temperature or elevated-temperature addition cure
Primary ApplicationsHigh-voltage dielectric encapsulation and potting
Key FeaturesNon-corrosive, low modulus, high dielectric strength, thermal stability
BenefitsStress relief, long-term reliability, compatibility with copper, aluminum, and common PCB substrates


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