High-voltage dielectric stability up to 30 kV/mm, ensuring reliable electrical insulation under demanding conditions.
Non-corrosive, platinum-catalyzed silicone gel formulation compatible with sensitive electronic components and metals.
Low modulus and excellent conformability for stress-free encapsulation of irregular geometries and fine-pitch assemblies.
Thermally stable from –50 °C to +200 °C, maintaining dielectric integrity across wide operating temperature ranges.
Ready-to-use two-part kit (Part A + Part B) with precise 1:1 mix ratio by volume for consistent processing and reproducible performance.
High-voltage power electronics encapsulation, including inverters, converters, and EV traction inverters.
Dielectric filling and potting of medium- and high-voltage sensors, busbar connections, and switchgear components.
Insulation protection for renewable energy systems such as solar string combiners and wind turbine power modules.
Underfill and gap-filling in industrial motor drives and uninterruptible power supply (UPS) systems.
Protection of high-density PCBs and power semiconductor modules subject to thermal cycling and partial discharge.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-component liquid kit (Part A and Part B) |
| Appearance (Mixed) | Translucent, viscous gel |
| Mix Ratio (by Volume) | 1:1 (A:B) |
| Cure Mechanism | Room-temperature or elevated-temperature addition cure |
| Primary Applications | High-voltage dielectric encapsulation and potting |
| Key Features | Non-corrosive, low modulus, high dielectric strength, thermal stability |
| Benefits | Stress relief, long-term reliability, compatibility with copper, aluminum, and common PCB substrates |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China