Non-corrosive, platinum-cured silicone gel formulation designed for long-term reliability in sensitive electronic assemblies.
Controlled firmness and low modulus enable stress relief for delicate components while maintaining structural integrity during thermal cycling.
Excellent dielectric strength (>20 kV/mm) and volume resistivity (>1 × 10¹⁴ Ω·cm) ensure robust electrical insulation performance.
Thermally stable across –50 °C to +200 °C with minimal outgassing, meeting NASA ASTM E595 low-volatile condensable materials (CVCM) requirements.
Two-part kit (Part A + Part B) with precise 1:1 mix ratio by volume for consistent cure and simplified handling in manufacturing environments.
Underfill and edge encapsulation of power semiconductor modules (e.g., IGBTs, SiC MOSFETs) in EV inverters and renewable energy converters.
Dielectric gap-filling between high-voltage battery cell interconnects and busbars in lithium-ion battery packs.
Protection of MEMS sensors, optical transceivers, and RF front-end modules from mechanical shock, vibration, and environmental contaminants.
Conformal potting of automotive ADAS control units, including radar and camera ECUs requiring EMI shielding compatibility and thermal management support.
Insulating encapsulation of medical imaging electronics and implantable device circuitry where biocompatibility-adjacent material safety is critical.
| Chemical Type | Platinum-cured addition-cure silicone gel |
| Product Form | Two-component liquid kit (Part A and Part B) |
| Appearance | Translucent, viscous liquid (Part A); translucent, low-viscosity liquid (Part B) |
| Mix Ratio (by volume) | 1:1 |
| Cure Condition | 25 °C / 7 days or 60 °C / 2 hours |
| Hardness (Shore 00, cured) | 15–25 |
| Density (g/cm³, cured) | 1.12–1.16 |
| UL Recognition | UL 94 V-0 (cured) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China