Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-4222 Dielectric Firm Gel Kit

Dow DOWSIL 3-4222 Dielectric Firm Gel Kit is a two-part silicone-based encapsulant offering excellent dielectric strength thermal stability and low modulus for sensitive electronic protection. It cures to a firm yet stress-relieving gel ideal for potting bonding and conformal coating in EV power modules and high-voltage systems. Meets UL 94 V-0 and RoHS compliance.
  • dow dowsil 3 4222 dielectric firm gel kit_207dae49
  • dow dowsil 3 4222 dielectric firm gel kit_207dae49

Features Of Dow DOWSIL 3-4222 Dielectric Firm Gel Kit

  1. Non-corrosive, platinum-cured silicone gel formulation designed for long-term reliability in sensitive electronic assemblies.

  2. Controlled firmness and low modulus enable stress relief for delicate components while maintaining structural integrity during thermal cycling.

  3. Excellent dielectric strength (>20 kV/mm) and volume resistivity (>1 × 10¹⁴ Ω·cm) ensure robust electrical insulation performance.

  4. Thermally stable across –50 °C to +200 °C with minimal outgassing, meeting NASA ASTM E595 low-volatile condensable materials (CVCM) requirements.

  5. Two-part kit (Part A + Part B) with precise 1:1 mix ratio by volume for consistent cure and simplified handling in manufacturing environments.

Typical Applications Of Dow DOWSIL 3-4222 Dielectric Firm Gel Kit

  1. Underfill and edge encapsulation of power semiconductor modules (e.g., IGBTs, SiC MOSFETs) in EV inverters and renewable energy converters.

  2. Dielectric gap-filling between high-voltage battery cell interconnects and busbars in lithium-ion battery packs.

  3. Protection of MEMS sensors, optical transceivers, and RF front-end modules from mechanical shock, vibration, and environmental contaminants.

  4. Conformal potting of automotive ADAS control units, including radar and camera ECUs requiring EMI shielding compatibility and thermal management support.

  5. Insulating encapsulation of medical imaging electronics and implantable device circuitry where biocompatibility-adjacent material safety is critical.

Specifications Of Dow DOWSIL 3-4222 Dielectric Firm Gel Kit

Chemical TypePlatinum-cured addition-cure silicone gel
Product FormTwo-component liquid kit (Part A and Part B)
AppearanceTranslucent, viscous liquid (Part A); translucent, low-viscosity liquid (Part B)
Mix Ratio (by volume)1:1
Cure Condition25 °C / 7 days or 60 °C / 2 hours
Hardness (Shore 00, cured)15–25
Density (g/cm³, cured)1.12–1.16
UL RecognitionUL 94 V-0 (cured)


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