Name: Dow DOWSIL 3-4241 Dielectric Tough Gel Kit
Brand: Guangzhou Eric Wei Chemical Co., Ltd.

Features Of Dow DOWSIL 3-4241 Dielectric Tough Gel Kit

Ultra-low modulus silicone gel formulation enabling exceptional stress relief for sensitive electronic components.
Non-corrosive, halogen-free chemistry compliant with RoHS and REACH requirements.
Excellent dielectric strength (>20 kV/mm) and long-term insulation stability across wide temperature ranges.
Thixotropic behavior ensures no slump or migration after dispensing, even on vertical surfaces.
Two-part, room-temperature curing system with flexible mix ratio (10:1 by weight) for simplified processing.

Typical Applications Of Dow DOWSIL 3-4241 Dielectric Tough Gel Kit

Underfill and stress-relief encapsulation for power electronics modules (e.g., IGBTs, SiC MOSFETs).
Dielectric protection of high-voltage battery pack busbars and cell interconnects in EV applications.
Conformal cushioning for LED lighting arrays and automotive headlamp driver electronics.
Gap-filling insulation between PCBs and heat sinks in compact industrial power supplies.
Protection of MEMS sensors and precision analog circuitry from mechanical shock and thermal cycling.

Chemical Type	Two-part addition-cure silicone gel
Product Form	Kit (Part A: viscous gel; Part B: liquid catalyst)
Appearance	Translucent, off-white gel (Part A); colorless liquid (Part B)
Primary Applications	Dielectric encapsulation, stress-relief potting, high-voltage insulation
Key Features	Low modulus (~0.1 MPa), non-slumping, UL 94 V-0 rated (cured)
Benefits	Reduces thermal and mechanical stress, enables automated dispensing, supports reworkability
Curing Condition	Room temperature (23°C/50% RH); full cure in 7 days or accelerated at 60°C for 4 hours
Shelf Life	12 months unopened at ≤25°C (Part A); 9 months unopened at ≤25°C (Part B)

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E-mail: wangxingqiang@ericwchem.com
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