Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3-6752 Thermally Conductive Adhesive

Dow DOWSIL 3-6752 is a thermally conductive adhesive from Dow’s DOWSIL silicone portfolio. It offers high thermal conductivity, low modulus, and excellent adhesion to diverse substrates. Ideal for bonding heat sinks, power modules, and LED assemblies, it cures at room temperature or with mild heat. This single-component, solvent-free formulation ensures reliable long-term performance under thermal cycling and harsh environmental conditions.
  • dow dowsil 3 6752 thermally conductive adhesive_ae31e7e8
  • dow dowsil 3 6752 thermally conductive adhesive_ae31e7e8

Features Of Dow DOWSIL 3-6752 Thermally Conductive Adhesive

  1. High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.

  2. Room-temperature vulcanizing (RTV) silicone adhesive with low modulus, enabling stress relief and long-term reliability under thermal cycling.

  3. Excellent adhesion to diverse substrates including aluminum, copper, ceramics, and FR-4 PCBs without primers.

  4. UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical applications.

  5. Non-corrosive formulation—free of halogens, phosphorus, and sulfur—to protect sensitive electronic components.

Typical Applications Of Dow DOWSIL 3-6752 Thermally Conductive Adhesive

  1. Thermal interface bonding of power electronics modules (e.g., IGBTs, MOSFETs) to heat sinks.

  2. Attachment of LED packages and COB (chip-on-board) arrays in high-brightness lighting systems.

  3. Die-attach and heat sink mounting in automotive ADAS sensors and onboard chargers.

  4. Thermal management of 5G RF power amplifiers and base station components.

  5. Permanent bonding of battery cell monitoring units (BMUs) and thermal interface layers in EV battery packs.

Specifications Of Dow DOWSIL 3-6752 Thermally Conductive Adhesive

Chemical TypePlatinum-cured addition-cure silicone
Product FormTwo-part paste (Part A: filler-rich base; Part B: catalyst)
AppearanceGray, homogeneous paste
Primary ApplicationsStructural thermal bonding and gap-filling in electronics
Key FeaturesThermally conductive, electrically insulating, low-stress cure
BenefitsEliminates need for mechanical fasteners; reduces assembly time and thermal interface resistance
Cure ProfileRoom temperature (7 days) or accelerated at 80°C (30 min)
Storage Stability12 months at ≤25°C (unopened)


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