High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Room-temperature vulcanizing (RTV) silicone adhesive with low modulus, enabling stress relief and long-term reliability under thermal cycling.
Excellent adhesion to diverse substrates including aluminum, copper, ceramics, and FR-4 PCBs without primers.
UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical applications.
Non-corrosive formulation—free of halogens, phosphorus, and sulfur—to protect sensitive electronic components.
Thermal interface bonding of power electronics modules (e.g., IGBTs, MOSFETs) to heat sinks.
Attachment of LED packages and COB (chip-on-board) arrays in high-brightness lighting systems.
Die-attach and heat sink mounting in automotive ADAS sensors and onboard chargers.
Thermal management of 5G RF power amplifiers and base station components.
Permanent bonding of battery cell monitoring units (BMUs) and thermal interface layers in EV battery packs.
| Chemical Type | Platinum-cured addition-cure silicone |
| Product Form | Two-part paste (Part A: filler-rich base; Part B: catalyst) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Structural thermal bonding and gap-filling in electronics |
| Key Features | Thermally conductive, electrically insulating, low-stress cure |
| Benefits | Eliminates need for mechanical fasteners; reduces assembly time and thermal interface resistance |
| Cure Profile | Room temperature (7 days) or accelerated at 80°C (30 min) |
| Storage Stability | 12 months at ≤25°C (unopened) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China