High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides stress relief and accommodates thermal expansion mismatches.
Room-temperature cure with optional heat acceleration, enabling flexible manufacturing integration.
Excellent adhesion to common substrates including aluminum, copper, ceramics, and FR-4 PCBs.
UL 94 V-0 rated for flame resistance, supporting safety-compliant end-use designs.
Thermal interface bonding of power modules and IGBTs in electric vehicle inverters.
Attachment of heat sinks to LED drivers and high-brightness LED packages.
Die attach and component mounting in aerospace and defense avionics systems.
Thermal management of 5G base station RF power amplifiers and mmWave modules.
| Chemical Type | Filler-loaded addition-cure silicone elastomer |
| Product Form | Paste (thixotropic, dual-syringe or cartridge dispense) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Structural thermal interface material (TIM), die attach, heat sink bonding |
| Key Features | Thermally conductive, electrically insulating, low-stress, flame retardant |
| Benefits | Improved reliability under thermal cycling, simplified assembly vs. mechanical fasteners, RoHS compliant |
| Cure Mechanism | Platinum-catalyzed hydrosilylation (RT or elevated temperature) |
| Storage Stability | 12 months at ≤25 °C in unopened container |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China