Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 3552 Base and Curing Agent

Dow DOWSIL 3552 Base and Curing Agent is a two-part, addition-cure silicone system offering excellent adhesion, low shrinkage, and thermal stability. Designed for encapsulation and potting of electronic components, it cures rapidly at room or elevated temperatures with precise 1:1 mix ratio. Part of Dow’s high-performance DOWSIL™ silicone portfolio.
  • dow dowsil 3552 base and curing agent_957177db
  • dow dowsil 3552 base and curing agent_957177db

Features Of Dow DOWSIL 3552 Base and Curing Agent

  1. Two-component, platinum-catalyzed addition-cure silicone system offering excellent adhesion to plastics, metals, and glass.

  2. Low viscosity base component enables easy mixing, dispensing, and air-release for high-fidelity molding.

  3. Fast room-temperature cure with optional heat acceleration—achieving handling strength in under 30 minutes.

  4. UL 94 V-0 rated flame retardancy without halogen additives, supporting safety-compliant electronic designs.

  5. Outstanding thermal stability (-40 °C to +200 °C continuous use) and long-term electrical insulation performance.

Typical Applications Of Dow DOWSIL 3552 Base and Curing Agent

  1. Encapsulation and potting of power electronics, including IGBT modules and EV onboard chargers.

  2. Sealing and bonding of LED lighting assemblies exposed to thermal cycling and humidity.

  3. Insulating coatings for automotive sensors operating under under-hood conditions.

  4. Dielectric encapsulation of high-voltage transformers and renewable energy inverters.

  5. Structural bonding of medical device housings requiring biocompatibility support (ISO 10993-5 tested).

Specifications Of Dow DOWSIL 3552 Base and Curing Agent

Chemical TypePlatinum-catalyzed addition-cure silicone elastomer
Product FormTwo-component liquid system (Base + Curing Agent)
AppearanceBase: Transparent, low-viscosity liquid; Curing Agent: Pale yellow, low-viscosity liquid
Primary ApplicationsEncapsulation, potting, sealing, and bonding in electronics and automotive systems
Key FeaturesFlame retardant (UL 94 V-0), low shrinkage, no by-products on cure
BenefitsImproved reliability under thermal stress, enhanced dielectric integrity, simplified processing
Cure SystemAddition cure (hydrosilylation); inhibited at room temperature, activated by heat
Storage Stability12 months at ≤25 °C in unopened containers


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *