Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL 680 ID Leveling Agent

Dow DOWSIL 680 ID Leveling Agent is a silicone-based additive from Dow’s DOWSIL series designed to enhance surface uniformity and reduce defects in industrial coatings and inks. It improves flow, eliminates orange peel, and ensures defect-free film formation without compromising substrate adhesion or cure performance.
  • dow dowsil 680 id leveling agent_cd25e4e1
  • dow dowsil 680 id leveling agent_cd25e4e1

Features Of Dow DOWSIL 680 ID Leveling Agent

  1. Exceptional surface leveling and defect reduction in high-solids and solvent-borne coatings.

  2. Low surface tension with minimal impact on substrate wetting or intercoat adhesion.

  3. Compatible with a broad range of resins including acrylics, polyurethanes, and alkyds.

  4. Non-silicone alternative offering excellent compatibility and reduced foaming tendency.

  5. Stable performance across varying temperatures and shear conditions during processing.

Typical Applications Of Dow DOWSIL 680 ID Leveling Agent

  1. Automotive OEM and refinish topcoats.

  2. Industrial maintenance and protective coatings.

  3. Wood finishing systems for furniture and cabinetry.

  4. Plastic coatings for automotive interior trim and consumer electronics.

  5. General-purpose decorative architectural coatings.

Specifications Of Dow DOWSIL 680 ID Leveling Agent

Chemical TypeModified polyacrylate copolymer
Product FormLiquid
AppearanceClear to slightly hazy, colorless to pale yellow liquid
Primary ApplicationsSurface leveling additive for coatings and inks
Key FeaturesLow foam, non-silicone, resin-compatible
BenefitsImproved flow, reduced orange peel, enhanced gloss uniformity
Recommended Use Level0.1–0.5 wt% based on total formulation
Storage ConditionsStore in original sealed container at 5–30°C; protect from freezing and direct sunlight


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *