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High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides excellent stress relief and accommodates thermal expansion mismatches.
Room-temperature vulcanizing (RTV) cure with rapid tack-free time and full cure within 24 hours at ambient conditions.
UL 94 V-0 rated for flame resistance, supporting safety compliance in power electronics and EV systems.
Excellent adhesion to common substrates including aluminum, copper, FR-4 PCBs, and thermoplastics without primer.
Thermal interface bonding of power modules and IGBTs in electric vehicle inverters.
Sealing and potting of LED drivers and high-brightness lighting housings.
Heat sink attachment in 5G base station RF power amplifiers.
Encapsulation of battery management system (BMS) sensors and control units.
Thermal management of onboard chargers (OBC) and DC-DC converters in hybrid and electric vehicles.
| Chemical Type | Condensation-cured silicone elastomer |
| Product Form | Two-component (Part A + Part B), paste |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Thermal interface material (TIM), structural sealing & bonding |
| Key Features | Thermally conductive, electrically insulating, low modulus, RTV cure |
| Benefits | Reduces thermal resistance, mitigates mechanical stress, enables automated dispensing |
| Cure Mechanism | Moisture-cured (Part A); catalyst-activated (Part B) |
| Storage Stability | 12 months at 25°C in unopened containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
