High-performance, one-component, moisture-curing silicone adhesive with excellent adhesion to low-surface-energy substrates.
Offers outstanding thermal stability across a wide operating temperature range (–55 °C to +200 °C).
Provides superior resistance to UV radiation, ozone, and weathering for long-term outdoor durability.
Low modulus formulation delivers high flexibility and stress relief in dynamic or thermally cycled assemblies.
Meets UL 94 HB flammability rating and complies with RoHS Directive 2011/65/EU.
Sealing and bonding of LED lighting housings and optical components.
Assembly of automotive sensors, control modules, and under-hood electronics.
Structural bonding of solar panel frames, junction boxes, and PV module encapsulation interfaces.
Mounting and sealing of industrial control enclosures exposed to harsh environmental conditions.
| Chemical Type | Acetoxy-cure silicone polymer |
| Product Form | Paste, thixotropic, non-sag |
| Appearance | Off-white to light beige, homogeneous paste |
| Primary Applications | Structural bonding, sealing, and gasketing in electronics and industrial assembly |
| Key Features | Moisture-curing, low modulus, excellent adhesion without primer |
| Benefits | Reduced assembly time, improved reliability under thermal cycling, no VOC emissions during cure |
| Cure Mechanism | Surface-to-core moisture cure at ambient temperature |
| Shelf Life (unopened) | 12 months at ≤25 °C in original sealed packaging |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China