Two-component, room-temperature-curing silicone adhesive system with excellent adhesion to low-surface-energy substrates.
Low modulus and high elongation provide superior stress relief and thermal cycling resistance.
UL 94 V-0 rated for flame retardancy, supporting safety-critical electronic encapsulation requirements.
Non-corrosive formulation—no acetic acid or other harmful by-products released during cure.
Designed for automated dispensing and consistent A:B mix ratio (1:1 by volume) with minimal pot life management overhead.
Encapsulation and bonding of power electronics modules, including IGBTs and inverters.
Structural assembly of LED lighting housings and heat sinks requiring thermal stability.
Sealing and bonding in automotive sensor assemblies exposed to vibration and wide temperature swings.
Die attach and underfill for hybrid circuits and ruggedized PCB assemblies.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Two-part liquid kit (Component A and Component B) |
| Appearance (Mixed) | Translucent, viscous paste |
| Mix Ratio (by Volume) | 1:1 |
| Cure Mechanism | Room temperature cure; accelerated at elevated temperatures (e.g., 60–80 °C) |
| Shore A Hardness (7 days, 23 °C/50% RH) | 30–35 |
| Elongation at Break (ASTM D412) | ≥250% |
| Primary Applications | Electronic encapsulation, structural bonding, and environmental sealing |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China