Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL EA-6060 Adhesive A&B Kit

Dow DOWSIL EA-6060 Adhesive A&B Kit is a two-part silicone-based structural adhesive offering rapid room-temperature cure high bond strength and excellent resistance to thermal cycling moisture and chemicals. Ideal for bonding metals plastics and composites in automotive electronics and industrial applications. Trusted Dow brand engineered for reliability precision and performance across demanding environments.
  • dow dowsil ea 6060 adhesive a b kit_900b39de
  • dow dowsil ea 6060 adhesive a b kit_900b39de

Features Of Dow DOWSIL EA-6060 Adhesive A&B Kit

  1. Two-component, room-temperature-curing silicone adhesive system with excellent adhesion to low-surface-energy substrates.

  2. Low modulus and high elongation provide superior stress relief and thermal cycling resistance.

  3. UL 94 V-0 rated for flame retardancy, supporting safety-critical electronic encapsulation requirements.

  4. Non-corrosive formulation—no acetic acid or other harmful by-products released during cure.

  5. Designed for automated dispensing and consistent A:B mix ratio (1:1 by volume) with minimal pot life management overhead.

Typical Applications Of Dow DOWSIL EA-6060 Adhesive A&B Kit

  1. Encapsulation and bonding of power electronics modules, including IGBTs and inverters.

  2. Structural assembly of LED lighting housings and heat sinks requiring thermal stability.

  3. Sealing and bonding in automotive sensor assemblies exposed to vibration and wide temperature swings.

  4. Die attach and underfill for hybrid circuits and ruggedized PCB assemblies.

Specifications Of Dow DOWSIL EA-6060 Adhesive A&B Kit

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormTwo-part liquid kit (Component A and Component B)
Appearance (Mixed)Translucent, viscous paste
Mix Ratio (by Volume)1:1
Cure MechanismRoom temperature cure; accelerated at elevated temperatures (e.g., 60–80 °C)
Shore A Hardness (7 days, 23 °C/50% RH)30–35
Elongation at Break (ASTM D412)≥250%
Primary ApplicationsElectronic encapsulation, structural bonding, and environmental sealing


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