Ultra-low outgassing formulation compliant with NASA ASTM E595 requirements for space-grade microelectronics assembly.
Thermally conductive (0.8 W/m·K) and electrically insulating, enabling efficient heat dissipation without short-circuit risk.
Room-temperature cure with optional heat acceleration (e.g., 60°C for 60 min), supporting high-throughput and low-thermal-stress bonding.
Excellent adhesion to FR-4, silicon, ceramic, copper, and gold-plated substrates without primers.
High glass transition temperature (>120°C) and long-term stability under thermal cycling (-55°C to +125°C).
Die attach for power modules and RF semiconductor packages.
MEMS sensor encapsulation and housing bonding in automotive and aerospace systems.
Attachment of optical components (lenses, VCSELs, photodiodes) in precision optoelectronics.
Underfill and edge bonding for flip-chip assemblies requiring low ionic contamination.
Hermetic sealing of hybrid microcircuits and radiation-hardened electronics.
| Chemical Type | Silicone-based thermoset adhesive |
| Product Form | Paste (two-component, A+B mix ratio 10:1 by weight) |
| Appearance | Opaque gray paste (Component A), translucent amber paste (Component B) |
| Primary Applications | Die attach, MEMS bonding, optoelectronic assembly, hermetic sealing |
| Key Features | Low outgassing, thermally conductive, electrically insulating, RoHS-compliant |
| Shelf Life (unopened, 25°C) | 6 months from manufacture date |
| Cure Schedule (standard) | 24 hours at 25°C or 60 min at 60°C after mixing |
| Viscosity (Component A, 25°C) | 80,000–100,000 cP (Brookfield RV, spindle #7, 2 rpm) |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China