Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL EA-6700 Microelectronics Adhesive

Dow DOWSIL EA-6700 Microelectronics Adhesive is a high-performance, thermally conductive, electrically insulating silicone adhesive designed for precision bonding in microelectronics packaging. It offers low modulus, excellent thermal stability (-65°C to 200°C), rapid room-temperature cure, and superior adhesion to FR4, ceramics, and coated metals—ideal for MEMS, sensors, and advanced IC assembly.
  • dow dowsil ea 6700 microelectronics adhesive_e30f7edc
  • dow dowsil ea 6700 microelectronics adhesive_e30f7edc

Features Of Dow DOWSIL EA-6700 Microelectronics Adhesive

  1. Ultra-low outgassing formulation compliant with NASA ASTM E595 requirements for space-grade microelectronics assembly.

  2. Thermally conductive (0.8 W/m·K) and electrically insulating, enabling efficient heat dissipation without short-circuit risk.

  3. Room-temperature cure with optional heat acceleration (e.g., 60°C for 60 min), supporting high-throughput and low-thermal-stress bonding.

  4. Excellent adhesion to FR-4, silicon, ceramic, copper, and gold-plated substrates without primers.

  5. High glass transition temperature (>120°C) and long-term stability under thermal cycling (-55°C to +125°C).

Typical Applications Of Dow DOWSIL EA-6700 Microelectronics Adhesive

  1. Die attach for power modules and RF semiconductor packages.

  2. MEMS sensor encapsulation and housing bonding in automotive and aerospace systems.

  3. Attachment of optical components (lenses, VCSELs, photodiodes) in precision optoelectronics.

  4. Underfill and edge bonding for flip-chip assemblies requiring low ionic contamination.

  5. Hermetic sealing of hybrid microcircuits and radiation-hardened electronics.

Specifications Of Dow DOWSIL EA-6700 Microelectronics Adhesive

Chemical TypeSilicone-based thermoset adhesive
Product FormPaste (two-component, A+B mix ratio 10:1 by weight)
AppearanceOpaque gray paste (Component A), translucent amber paste (Component B)
Primary ApplicationsDie attach, MEMS bonding, optoelectronic assembly, hermetic sealing
Key FeaturesLow outgassing, thermally conductive, electrically insulating, RoHS-compliant
Shelf Life (unopened, 25°C)6 months from manufacture date
Cure Schedule (standard)24 hours at 25°C or 60 min at 60°C after mixing
Viscosity (Component A, 25°C)80,000–100,000 cP (Brookfield RV, spindle #7, 2 rpm)


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