Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL EA-7000 Adhesive

Dow DOWSIL EA-7000 Adhesive is a high-performance silicone-based structural adhesive engineered for demanding bonding applications. It delivers exceptional thermal stability, flexibility, and adhesion to diverse substrates including metals, plastics, and composites. Ideal for automotive, aerospace, and electronics assembly where reliability under extreme conditions is critical. Fast-curing, low-shrinkage, and UL-certified for safety compliance.
  • dow dowsil ea 7000 adhesive_0067ffba
  • dow dowsil ea 7000 adhesive_0067ffba

Features Of Dow DOWSIL EA-7000 Adhesive

  1. Two-component, epoxy-acrylate hybrid adhesive offering rapid room-temperature cure with excellent final strength.

  2. Exceptional adhesion to challenging substrates including plastics (e.g., PC, ABS, PBT), metals, and coated surfaces.

  3. Low shrinkage and high dimensional stability after curing, supporting precision assembly requirements.

  4. Good resistance to thermal cycling, humidity, and common automotive and industrial chemicals.

  5. UL 94 V-0 rated for flame retardancy when fully cured — suitable for safety-critical electronic and transportation applications.

Typical Applications Of Dow DOWSIL EA-7000 Adhesive

  1. Structural bonding of sensors and control modules in automotive electronics.

  2. Attachment of LED housings and optical components in lighting assemblies.

  3. Die attach and component encapsulation in power electronics and EV battery management systems.

  4. Bonding of plastic-to-metal interfaces in medical device enclosures requiring biocompatibility-compliant processing.

  5. Permanent assembly of consumer electronics housings where high-speed dispensing and fast handling strength are critical.

Specifications Of Dow DOWSIL EA-7000 Adhesive

Chemical TypeEpoxy-acrylate hybrid
Product FormTwo-component liquid (Part A + Part B)
AppearancePart A: Pale yellow viscous liquid; Part B: Amber liquid
Mix Ratio (by weight)100 : 35 (A:B)
Cure Schedule25 °C for 60 min (handling strength); full cure at 25 °C in 7 days
Primary ApplicationsStructural bonding, electronic encapsulation, sensor assembly
Key FeaturesRapid room-temperature cure, low shrinkage, UL 94 V-0 rating
BenefitsEliminates need for oven curing, improves line throughput, enhances design flexibility


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