Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

DOW DOWSIL EA-9189 H Silicone Adhesive

DOW DOWSIL EA-9189 H Silicone Adhesive is a high-performance, heat-curable, two-part silicone elastomer engineered for demanding aerospace and electronics bonding. It offers excellent thermal stability (–65°C to 200°C), low outgassing, superior adhesion to metals and composites, and NASA-approved low volatility. Ideal for structural encapsulation and vibration damping.
  • dow dowsil ea 9189 h silicone adhesive_8b6ae087
  • dow dowsil ea 9189 h silicone adhesive_8b6ae087

Features Of DOW DOWSIL EA-9189 H Silicone Adhesive

  1. High-performance, heat-curable silicone adhesive with excellent thermal stability up to 200 °C continuous use.

  2. Outstanding adhesion to challenging substrates including metals, ceramics, glass, and engineered plastics.

  3. Low modulus formulation provides superior stress relief and resistance to thermal cycling-induced failure.

  4. UL 94 V-0 rated for flame retardancy, supporting safety-critical electronic and aerospace assemblies.

  5. Low outgassing and high purity—compliant with ASTM E595 for space-grade applications.

Typical Applications Of DOW DOWSIL EA-9189 H Silicone Adhesive

  1. Aerospace avionics bonding and potting, including sensor housings and flight control modules.

  2. High-reliability LED lighting assemblies requiring thermal management and long-term environmental resistance.

  3. Power electronics encapsulation in electric vehicle (EV) inverters and onboard chargers.

  4. Satellite and spacecraft subsystem bonding where vacuum compatibility and radiation resistance are essential.

  5. Medical device assembly demanding biocompatibility support (ISO 10993-tested components) and sterilization resistance.

Specifications Of DOW DOWSIL EA-9189 H Silicone Adhesive

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormTwo-part liquid system (Part A: base; Part B: catalyst)
AppearanceOpaque off-white viscous liquid (Part A); translucent pale yellow liquid (Part B)
Primary ApplicationsBonding, sealing, and structural encapsulation in high-temp/high-reliability environments
Key FeaturesThermal cycling resistance, low compression set, UL 94 V-0, ASTM E595 compliant
Recommended Cure Schedule20 min at 150 °C or 60 min at 125 °C (post-cure optional)
Shelf Life (Unopened)12 months at ≤25 °C, protected from moisture and light
Storage ConditionsRefrigerated at 2–8 °C; warm to room temperature before use


Get in Touch with ERICW
Let competitive chemical materials go global.

Your Name *

Your Email *

Your Phone

Country

Your Message *