Ultra-low modulus formulation provides exceptional stress relief for sensitive electronic components.
Non-corrosive and halogen-free, ensuring compatibility with copper, silver, and other sensitive metallizations.
Excellent thermal stability across a wide operating temperature range (–50 °C to +200 °C).
Self-healing properties maintain long-term encapsulation integrity after mechanical deformation or thermal cycling.
Low surface tension enables superior conformal coverage and void-free dispensing on complex geometries.
Encapsulation and protection of LED packages in automotive lighting and outdoor signage.
Underfill and stress-buffering material for power modules and IGBTs in EV inverters and renewable energy systems.
Die-attach and cavity-filling gel for MEMS sensors and high-reliability medical electronics.
Thermal interface and mechanical damping layer in 5G RF front-end modules and millimeter-wave devices.
Protection of wire bonds and fine-pitch interconnects in aerospace avionics assemblies.
| Chemical Type | Platinum-cured addition-cure silicone gel |
| Product Form | Two-component liquid (Part A + Part B) |
| Appearance | Clear, viscous liquid (Part A); colorless to pale yellow liquid (Part B) |
| Primary Applications | Electronic encapsulation, stress relief, and environmental protection |
| Key Features | Ultra-low modulus, non-corrosive, self-healing, halogen-free |
| Shore A Hardness (Cured) | 10–15 (ASTM D2240) |
| Operating Temperature Range | –50 °C to +200 °C (continuous) |
| UL Recognition | UL 94 V-0 (per cured thickness ≥1.6 mm) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China