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Two-component, platinum-catalyzed silicone gel system offering controlled thixotropy for sag resistance in vertical and overhead applications.
Low modulus and high elasticity enable excellent stress relief and long-term reliability in sensitive electronic assemblies.
Room-temperature curing with tunable pot life and cure speed via Part A/Part B ratio adjustment.
Ultra-low compression set and outstanding thermal stability across –55 °C to 200 °C operating range.
Halogen-free formulation compliant with RoHS and REACH directives for environmentally responsible manufacturing.
Underfill and edge bonding for flip-chip and CSP packages in semiconductor packaging.
Conformal coating and cavity filling for power electronics modules and IGBT assemblies.
Vibration-damping encapsulation of MEMS sensors and precision optical components.
Thermal interface material (TIM) buffer layer between heat-generating devices and heatsinks.
Sealing and cushioning in automotive ADAS camera modules and LED lighting systems.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-part liquid system (Part A: base polymer + filler; Part B: crosslinker + catalyst) |
| Appearance | Part A: translucent viscous liquid; Part B: translucent low-viscosity liquid |
| Primary Applications | Electronic encapsulation, underfill, stress-relieving gel, conformal protection |
| Key Features | Thixotropic, ultra-low modulus, non-corrosive, no by-products |
| Benefits | Minimizes CTE mismatch stress, prevents die cracking, enables reworkability pre-cure |
| Curing Conditions | RT cure (7 days) or accelerated cure (1–2 hrs @ 80–125 °C) |
| Storage Stability | 12 months at ≤25 °C in unopened containers |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
