Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL Q5-8401 Adhesive Kit Silicone Adhesive

Dow DOWSIL Q5-8401 Adhesive Kit is a two-part platinum-cured silicone adhesive system from Dow’s DOWSIL series, engineered for high-strength bonding of diverse substrates including metals, plastics and elastomers. It offers excellent thermal stability, low compression set and rapid room-temperature cure, ideal for demanding industrial assembly and sealing applications.
  • dow dowsil q5 8401 adhesive kit silicone adhesive_2343c3d9
  • dow dowsil q5 8401 adhesive kit silicone adhesive_2343c3d9

Features Of Dow DOWSIL Q5-8401 Adhesive Kit Silicone Adhesive

  1. Two-part, platinum-cured silicone adhesive system offering rapid room-temperature cure upon mixing.

  2. Excellent adhesion to low-surface-energy substrates including silicone rubber, plastics, and coated metals without primers.

  3. High flexibility and elongation (>200%) with outstanding resistance to thermal cycling (-55 °C to +200 °C continuous).

  4. Low compression set and superior electrical insulation properties for long-term reliability in demanding environments.

  5. Non-corrosive, halogen-free formulation compliant with RoHS and REACH requirements.

Typical Applications Of Dow DOWSIL Q5-8401 Adhesive Kit Silicone Adhesive

  1. Sealing and bonding of LED lighting housings and heat sinks in outdoor and high-humidity conditions.

  2. Assembly of medical device enclosures requiring biocompatibility support (ISO 10993-5 cytotoxicity tested).

  3. Structural bonding of automotive sensors, ECUs, and power electronics exposed to vibration and thermal stress.

  4. Die-attach and potting of flexible printed circuits (FPCs) and hybrid microelectronics modules.

Specifications Of Dow DOWSIL Q5-8401 Adhesive Kit Silicone Adhesive

Chemical TypePlatinum-cured addition-cure silicone
Product FormTwo-component kit (Part A: base; Part B: catalyst)
AppearancePart A: translucent viscous liquid; Part B: translucent liquid
Mix Ratio by Weight10:1 (A:B)
Cure ProfileRT cure: 24 h @ 23 °C / 50% RH; accelerated cure: 2 h @ 80 °C
Hardness (Shore A)30–35 after full cure
Tensile Strength4.0–5.5 MPa
Elongation at Break≥200%


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