English
Español
tiếng việt
русский
High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation enabling stress relief and long-term reliability under thermal cycling.
Room-temperature cure with optional heat acceleration—no mixing required, simplifying manufacturing processes.
Excellent electrical insulation properties with high dielectric strength (>15 kV/mm).
UL 94 V-0 rated flame retardancy for enhanced safety in power electronics and automotive applications.
Attachment of power semiconductor devices (e.g., IGBTs, MOSFETs) to heatsinks in inverters and converters.
Thermal interface bonding in electric vehicle (EV) battery management systems (BMS) and onboard chargers.
Die attach and component mounting in LED lighting modules requiring reliable thermal management.
Thermal bonding of sensors, controllers, and DC-DC converters in industrial automation equipment.
Attachment of heat-generating components in 5G base station power amplifiers and RF modules.
| Chemical Type | Platinum-cured addition-cure silicone |
| Product Form | Single-component liquid |
| Appearance | Off-white, viscous paste |
| Primary Applications | Thermally conductive die attach and component bonding |
| Key Features | Thermally conductive, electrically insulating, low modulus, flame retardant |
| Benefits | Reduces thermal resistance, accommodates CTE mismatch, enhances long-term reliability |
| Cure Mechanism | Room temperature cure (7 days @ 25°C) or accelerated cure (60 min @ 125°C) |
| UL Recognition | UL 94 V-0, UL 746C recognized |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
Have a Questions? Call Us:
Add:
Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
