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High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.
Room-temperature cure with optional heat acceleration—enabling flexible manufacturing integration.
Electrically insulating properties prevent short circuits while maintaining robust thermal performance.
Thixotropic paste consistency ensures precise dispensing and minimal slump during application.
Thermal interface material (TIM) for power modules and IGBT substrates in electric vehicles and inverters.
Bonding and heat transfer between LED packages and metal-core printed circuit boards (MCPCBs).
Attachment of heat sinks to semiconductor devices, including MOSFETs and SiC/GaN power components.
Die attach and thermal management in industrial power supplies and renewable energy converters.
| Chemical Type | Platinum-cured addition-cure silicone |
| Product Form | Thixotropic paste |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Thermal interface bonding, heat sink attachment, power electronics encapsulation |
| Key Features | Thermally conductive, electrically insulating, low modulus, room-temperature curable |
| Benefits | Reduces thermal resistance, accommodates CTE mismatch, enhances long-term reliability |
| Cure Mechanism | Platinum-catalyzed hydrosilylation (addition cure) |
| Storage Condition | Store at 5–25°C; protect from moisture and direct sunlight |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
