High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.
Room-temperature vulcanizing (RTV) system with rapid tack-free time and full cure within 24 hours at ambient conditions.
Excellent adhesion to common substrates including aluminum, copper, stainless steel, and FR-4 PCBs without primers.
UL 94 V-0 rated for flame resistance and compliant with RoHS and REACH regulatory requirements.
Thermal bonding of power electronics modules (e.g., IGBTs, MOSFETs) to heat sinks in EV inverters and industrial drives.
Die-attach and heat-spreader bonding in LED lighting systems requiring high lumen maintenance and thermal stability.
Attachment of sensors, battery management system (BMS) components, and DC-DC converters in automotive electronics.
Structural thermal interface in 5G base station RF power amplifiers and telecom infrastructure equipment.
| Chemical Type | Platinum-cured addition-cure silicone elastomer |
| Product Form | Paste (two-component, Part A + Part B) |
| Appearance | Gray, homogeneous paste |
| Primary Applications | Thermally conductive structural bonding and encapsulation |
| Key Features | RTV cure, low modulus, high thermal conductivity, electrical insulation |
| Benefits | Reduced thermal resistance, vibration damping, long-term aging stability, no corrosive by-products |
| Cure System | Addition cure (platinum catalyst); no condensation by-products |
| Storage Stability | 12 months at ≤25 °C (unopened containers) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China