Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Dow DOWSIL SE 4485 Thermally Conductive Silicone Adhesive

Dow DOWSIL SE 4485 is a thermally conductive silicone adhesive offering excellent heat dissipation, low modulus elasticity, and strong adhesion to metals, plastics, and ceramics. It cures at room temperature or accelerated with heat, delivering reliable bonding and thermal management for EV batteries, power electronics, and LED assemblies.
  • dow dowsil se 4485 thermally conductive silicone adhesive_5b08a773
  • dow dowsil se 4485 thermally conductive silicone adhesive_5b08a773

Features Of Dow DOWSIL SE 4485 Thermally Conductive Silicone Adhesive

  1. High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.

  2. Low modulus silicone formulation provides excellent stress relief and long-term reliability under thermal cycling.

  3. Room-temperature vulcanizing (RTV) system with rapid tack-free time and full cure within 24 hours at ambient conditions.

  4. Excellent adhesion to common substrates including aluminum, copper, stainless steel, and FR-4 PCBs without primers.

  5. UL 94 V-0 rated for flame resistance and compliant with RoHS and REACH regulatory requirements.

Typical Applications Of Dow DOWSIL SE 4485 Thermally Conductive Silicone Adhesive

  1. Thermal bonding of power electronics modules (e.g., IGBTs, MOSFETs) to heat sinks in EV inverters and industrial drives.

  2. Die-attach and heat-spreader bonding in LED lighting systems requiring high lumen maintenance and thermal stability.

  3. Attachment of sensors, battery management system (BMS) components, and DC-DC converters in automotive electronics.

  4. Structural thermal interface in 5G base station RF power amplifiers and telecom infrastructure equipment.

Specifications Of Dow DOWSIL SE 4485 Thermally Conductive Silicone Adhesive

Chemical TypePlatinum-cured addition-cure silicone elastomer
Product FormPaste (two-component, Part A + Part B)
AppearanceGray, homogeneous paste
Primary ApplicationsThermally conductive structural bonding and encapsulation
Key FeaturesRTV cure, low modulus, high thermal conductivity, electrical insulation
BenefitsReduced thermal resistance, vibration damping, long-term aging stability, no corrosive by-products
Cure SystemAddition cure (platinum catalyst); no condensation by-products
Storage Stability12 months at ≤25 °C (unopened containers)


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