Re-workable formulation enables non-destructive component removal and reapplication without residue or substrate damage.
Ultra-low modulus provides excellent conformability to irregular surfaces and accommodates coefficient of thermal expansion (CTE) mismatch.
No pump-out or dry-out under thermal cycling, ensuring long-term interfacial stability in high-reliability electronics.
Non-silicone-oil bleeding design prevents contamination of adjacent components and optical sensors.
Thermally conductive with intrinsic tackiness—requires no additional adhesive layer or mechanical fixation.
High-power LED modules requiring field serviceability and thermal management.
Automotive ADAS radar and camera assemblies subject to rigorous thermal cycling and vibration.
5G base station power amplifiers and RF front-end modules demanding reliable heat dissipation and rework capability.
Aerospace and defense avionics where mission-critical rework and zero outgassing are essential.
AI accelerator cards and GPU cooling interfaces in data center servers with tight assembly tolerances.
| Chemical Type | Silicone-based thermally conductive gel |
| Product Form | Paste (non-slumping, thixotropic) |
| Appearance | Opaque gray, uniform consistency |
| Thermal Conductivity | 3.0 W/m·K (ASTM D5470) |
| Hardness (Shore 00) | 15–20 (ASTM D2240) |
| Density | 2.4 g/cm³ (ASTM D792) |
| Operating Temperature Range | −50 °C to +200 °C |
| UL Recognition | UL 94 V-0 (flammability rating) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China