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High thermal conductivity (1.5 W/m·K) for efficient heat dissipation in demanding electronic assemblies.
Room-temperature cure with optional heat acceleration, enabling flexible manufacturing integration.
Low modulus elastomeric formulation that accommodates coefficient of thermal expansion (CTE) mismatch between substrates.
Excellent adhesion to common electronics substrates including aluminum, copper, FR-4, and molded plastics without primers.
UL 94 V-0 rated for flame resistance, supporting compliance in safety-critical applications.
Thermal interface bonding of power modules and IGBTs to heat sinks in electric vehicle inverters.
Die attach and heat spreader attachment in high-power LED lighting systems.
Thermal management of battery module cold plates and cell-to-plate interfaces in EV battery packs.
Attachment of sensors, controllers, and DC-DC converters in automotive under-hood electronics.
| Chemical Type | Condensation-cure silicone adhesive |
| Product Form | Two-component (Part A + Part B), paste |
| Appearance | Off-white, uniform paste |
| Primary Applications | Structural thermal interface material (TIM) for power electronics |
| Key Features | Thermally conductive, electrically insulating, low-stress, flame retardant |
| Benefits | Reduces thermal resistance, improves reliability under thermal cycling, eliminates mechanical fasteners |
| Cure Mechanism | Room temperature (7 days) or accelerated (60°C for 2 hours) |
| Storage Stability | 12 months at ≤25°C (unopened) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
