Ultra-low modulus silicone gel formulation for stress-free encapsulation and conformal protection.
Excellent dielectric insulation properties with high volume resistivity (>1 × 10¹⁵ Ω·cm) and low dielectric loss.
Thermally stable across -50 °C to +200 °C, maintaining integrity under repeated thermal cycling.
Non-corrosive, acetoxy-free cure chemistry—safe for sensitive electronics and precious metals.
Self-leveling and thixotropic behavior enables precise dispensing and void-free coverage on complex geometries.
High-voltage power module potting in EV inverters and renewable energy converters.
Dielectric bonding and gap-filling for IGBTs, SiC MOSFETs, and LED driver assemblies.
Thermal interface and electrical isolation in aerospace avionics and downhole oil & gas sensors.
Encapsulation of medical device electronics requiring biocompatibility-compliant materials (ISO 10993 tested).
Protection of MEMS, optical sensors, and fine-pitch automotive ECUs exposed to vibration and moisture.
| Chemical Type | Platinum-catalyzed addition-cure silicone gel |
| Product Form | Two-part liquid system (Part A: base; Part B: catalyst) |
| Appearance | Translucent, viscous gel (Part A); colorless liquid (Part B) |
| Primary Applications | Dielectric encapsulation, stress-relieving bonding, high-voltage insulation |
| Key Features | Ultra-low compression set, non-slumping, reworkable before full cure |
| Benefits | Reduces thermal/mechanical stress on solder joints and fragile components |
| Cure System | Room temperature or accelerated heat cure (e.g., 60 °C for 2 hrs) |
| Shelf Life | 12 months unopened at ≤25 °C (refrigerated storage recommended for extended stability) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China