Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

DOWSIL 3-4241 Dielectric Silicone Gel Adhesive

DOWSIL 3-4241 is a dielectric silicone gel adhesive from Dow’s DOWSIL™ series—offering ultra-low modulus, excellent thermal cycling resistance, and non-corrosive curing. It bonds diverse substrates, remains tack-free after cure, and provides reliable electrical insulation for EV battery modules and power electronics packaging.
  • dowsil 3 4241 dielectric silicone gel adhesive_13a019a5
  • dowsil 3 4241 dielectric silicone gel adhesive_13a019a5

Features Of DOWSIL 3-4241 Dielectric Silicone Gel Adhesive

  1. Ultra-low modulus silicone gel formulation for stress-free encapsulation and conformal protection.

  2. Excellent dielectric insulation properties with high volume resistivity (>1 × 10¹⁵ Ω·cm) and low dielectric loss.

  3. Thermally stable across -50 °C to +200 °C, maintaining integrity under repeated thermal cycling.

  4. Non-corrosive, acetoxy-free cure chemistry—safe for sensitive electronics and precious metals.

  5. Self-leveling and thixotropic behavior enables precise dispensing and void-free coverage on complex geometries.

Typical Applications Of DOWSIL 3-4241 Dielectric Silicone Gel Adhesive

  1. High-voltage power module potting in EV inverters and renewable energy converters.

  2. Dielectric bonding and gap-filling for IGBTs, SiC MOSFETs, and LED driver assemblies.

  3. Thermal interface and electrical isolation in aerospace avionics and downhole oil & gas sensors.

  4. Encapsulation of medical device electronics requiring biocompatibility-compliant materials (ISO 10993 tested).

  5. Protection of MEMS, optical sensors, and fine-pitch automotive ECUs exposed to vibration and moisture.

Specifications Of DOWSIL 3-4241 Dielectric Silicone Gel Adhesive

Chemical TypePlatinum-catalyzed addition-cure silicone gel
Product FormTwo-part liquid system (Part A: base; Part B: catalyst)
AppearanceTranslucent, viscous gel (Part A); colorless liquid (Part B)
Primary ApplicationsDielectric encapsulation, stress-relieving bonding, high-voltage insulation
Key FeaturesUltra-low compression set, non-slumping, reworkable before full cure
BenefitsReduces thermal/mechanical stress on solder joints and fragile components
Cure SystemRoom temperature or accelerated heat cure (e.g., 60 °C for 2 hrs)
Shelf Life12 months unopened at ≤25 °C (refrigerated storage recommended for extended stability)


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