High-performance reactive liquid polymer designed to enhance impact resistance without sacrificing thermal stability.
Low viscosity enables excellent processability and uniform dispersion in thermosetting resin systems.
Compatible with epoxy, phenolic, and cyanate ester matrices for broad formulation flexibility.
Reduces microcracking and improves fracture toughness in cured composites under dynamic loading.
Halogen-free formulation supports compliance with RoHS and UL94 V-0 flame-retardant requirements.
Aerospace structural adhesives and prepreg systems requiring high fracture energy absorption.
Electronics encapsulants and underfill materials for advanced semiconductor packaging.
High-reliability printed circuit board (PCB) laminates, especially in high-speed/high-frequency substrates.
Automotive power electronics modules demanding thermal cycling durability and mechanical robustness.
Wind turbine blade resins where fatigue resistance and delamination suppression are critical.
| Chemical Type | Reactive carboxyl-terminated liquid polymer |
| Product Form | Pale yellow to amber viscous liquid |
| Appearance | Clear, homogeneous liquid at 25°C |
| Viscosity (25°C) | 1,800–2,500 mPa·s |
| Acid Value | 28–32 mg KOH/g |
| Density (25°C) | 1.06–1.09 g/cm³ |
| Storage Stability | ≥12 months at ≤25°C in sealed container |
| Primary Applications | Epoxy-based composites, electronic encapsulants, structural adhesives |
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