High-performance liquid epoxy resin modifier designed to enhance impact resistance without sacrificing thermal stability.
Reactive functionality enables covalent bonding with epoxy matrices, ensuring permanent toughening and long-term durability.
Low viscosity at room temperature facilitates easy handling, homogeneous dispersion, and simplified processing in standard epoxy formulations.
Maintains excellent electrical insulation properties, making it suitable for high-reliability electronic encapsulation applications.
Compatible with common amine and anhydride curing agents, offering formulation flexibility across diverse industrial systems.
Underfill materials for flip-chip and wafer-level packaging in semiconductor assembly.
Encapsulants and glob-tops for LED modules and power electronics requiring crack resistance.
Structural adhesives for aerospace composites where toughness-to-glass transition balance is critical.
High-performance printed circuit board (PCB) laminates and prepregs demanding improved delamination resistance.
| Chemical Type | Reactive liquid carboxyl-terminated polybutadiene (CTPB)-based toughener |
| Product Form | Pale yellow to light amber viscous liquid |
| Appearance | Clear, homogeneous liquid; slight opalescence permissible |
| Primary Applications | Epoxy-based encapsulants, underfills, structural adhesives, and laminating resins |
| Key Features | Reactive toughening, low moisture absorption, thermal shock resistance |
| Benefits | Reduces brittle fracture, improves thermal cycling performance, enhances interfacial adhesion |
| Storage Conditions | Store at 5–25°C in sealed containers; protect from moisture and direct sunlight |
| Shelf Life | 12 months from date of manufacture when stored properly |
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E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China