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High-purity aromatic amine derivative with consistent batch-to-batch reproducibility.
Excellent thermal stability up to 220 °C, suitable for high-temperature polymerization processes.
Low residual solvent content (< 0.1 wt%), minimizing downstream purification requirements.
Controlled particle size distribution for improved dispersibility in resin systems.
Non-hygroscopic solid form ensuring long-term storage stability under ambient dry conditions.
Key building block for high-performance polyimide precursors in flexible printed circuit boards (FPCBs).
Reactive intermediate in the synthesis of heat-resistant epoxy curing agents for aerospace composites.
Monomer component in specialty polyamide-imide (PAI) resins for automotive under-hood applications.
Functional additive in advanced photoresist formulations for semiconductor lithography.
| Chemical Type | Aromatic diamine derivative |
| Product Form | Free-flowing off-white crystalline powder |
| Appearance | Uniform crystalline solid, no visible foreign particles |
| Purity (HPLC) | ≥ 99.5 wt% |
| Melting Point | 184–188 °C |
| Moisture Content (Karl Fischer) | ≤ 0.05 wt% |
| Solubility | Freely soluble in NMP, DMF, and DMAc; insoluble in water |
| Storage Condition | Store under nitrogen at 15–25 °C in sealed containers away from light and moisture |
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