Soft, low-modulus silicone gel with excellent conformability and stress-relief properties for sensitive electronic components.
Ultra-low volatility and minimal outgassing—meets NASA ASTM E595 low-outgassing requirements for space-grade applications.
Thermally stable across –50 °C to +200 °C with negligible permanent set after thermal cycling.
Electrically insulating with high dielectric strength (>20 kV/mm) and stable volume resistivity (>1 × 10¹⁴ Ω·cm).
Ready-to-use, non-tacky formulation requiring no mixing or curing—enables immediate application and handling.
Underfill and stress-buffering material for power modules and IGBTs in electric vehicles and renewable energy inverters.
Encapsulation and protection of LED packages, especially high-brightness and COB (Chip-on-Board) assemblies.
Thermal interface and mechanical damping layer between heat sinks and semiconductor devices in telecom infrastructure.
Conformal cushioning for MEMS sensors, optical components, and flexible PCB assemblies exposed to vibration or thermal shock.
| Chemical Type | Platinum-cured methylvinylsiloxane-based silicone gel |
| Product Form | Paste-like, thixotropic gel (non-sag, non-slump) |
| Appearance | Translucent, colorless to pale amber viscous gel |
| Shore A Hardness (25 °C, 7d) | 10–15 |
| Density (25 °C) | 1.12–1.16 g/cm³ |
| Volume Resistivity (25 °C) | >1 × 10¹⁴ Ω·cm |
| Dielectric Strength | >20 kV/mm |
| Operating Temperature Range | –50 °C to +200 °C (continuous) |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China