Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Tosoh Tosoh DETA Diethylenetriamine

Tosoh Tosoh DETA Diethylenetriamine is a high-purity, low-color amine catalyst and chelating agent from Tosoh’s premium amine series. Widely used in epoxy curing, water treatment, pharmaceutical synthesis, and metal ion sequestration, it offers excellent reactivity, thermal stability, and complexation efficiency with transition metals like Cu²⁺ and Ni²⁺.
  • tosoh tosoh deta diethylenetriamine_a1d2a03f
  • tosoh tosoh deta diethylenetriamine_a1d2a03f

Features Of Tosoh Tosoh DETA Diethylenetriamine

  1. High-purity diethylenetriamine (DETA) manufactured under strict Tosoh quality control standards.

  2. Consistent batch-to-batch performance with low volatility and excellent thermal stability.

  3. Superior chelating capacity and reactivity due to three active amine sites (two primary, one secondary).

  4. Low water content and minimal volatile impurities, supporting high-yield downstream synthesis.

  5. Compatible with industrial-scale handling and storage in carbon steel or stainless-steel systems.

Typical Applications Of Tosoh Tosoh DETA Diethylenetriamine

  1. Intermediate for polyamide and polyurea curing agents in high-performance coatings and adhesives.

  2. Chelating ligand in metal ion sequestration for water treatment and electroplating formulations.

  3. Building block for pharmaceutical intermediates and agrochemical active ingredients.

  4. Catalyst modifier and accelerator in epoxy resin crosslinking systems.

  5. Raw material for surfactant synthesis, including amidoamine and imidazoline derivatives.

Specifications Of Tosoh Tosoh DETA Diethylenetriamine

Chemical TypeAliphatic triamine
Product FormLiquid
AppearanceColorless to pale yellow clear liquid
Primary ApplicationsEpoxy curing, chelation, surfactant synthesis, pharmaceutical intermediates
Key FeaturesHigh amine value, low volatility, strong nucleophilicity, good solubility in water and polar organics
BenefitsEnables rapid cure kinetics, improves adhesion and chemical resistance in polymer networks
Molecular Weight103.16 g/mol
Boiling Point (at 760 mmHg)207–209 °C


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