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Neutral-cure, acetoxy-free formulation ensures excellent compatibility with sensitive substrates including metals, plastics, and painted surfaces.
High elasticity and permanent flexibility over a wide temperature range (–60 °C to +180 °C).
Excellent resistance to weathering, UV radiation, ozone, and aging without loss of mechanical properties.
Low modulus design provides superior stress relief in dynamic joints and accommodates high movement capability (±35%).
Ready-to-use one-component system with moisture-curing mechanism—no mixing required and easy application.
Sealing and bonding in automotive lighting assemblies (headlamps, tail lamps).
Encapsulation and potting of electronic components and sensors requiring long-term reliability.
Joint sealing in precision optical and medical device housings.
Assembly sealing for HVAC components exposed to thermal cycling and humidity.
Adhesive-sealant applications in high-cleanliness industrial equipment and cleanroom environments.
| Chemical Type | Platinum-cured addition-cure silicone |
| Product Form | Paste-like, thixotropic one-component compound |
| Appearance | Opaque off-white to light gray paste |
| Primary Applications | Sealing, bonding, and encapsulation in demanding technical applications |
| Key Features | Neutral cure, low modulus, high elongation, excellent adhesion without primer on many substrates |
| Shore A Hardness (7 days, 23 °C, 50% RH) | 25–30 |
| Elongation at Break (7 days) | ≥450% |
| Curing Depth (24 h, 23 °C, 50% RH) | Approx. 2–3 mm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
