Guangzhou Eric Wei Chemical Co., Ltd.
Guangzhou Eric Wei Chemical Co., Ltd.

Wacker GENIOSIL STP-E35 SMP Adhesive

Wacker GENIOSIL STP-E35 SMP Adhesive is a one-component, moisture-curing silane-terminated polymer adhesive offering excellent adhesion to diverse substrates, high elasticity, UV resistance, and no isocyanates. Ideal for construction and industrial bonding, it cures rapidly at ambient conditions with low VOC emissions and superior weathering performance.
  • wacker geniosil stp e35 smp adhesive_b0654ce3
  • wacker geniosil stp e35 smp adhesive_b0654ce3

Features Of Wacker GENIOSIL STP-E35 SMP Adhesive

  1. One-component, moisture-curing silyl-modified polymer (SMP) adhesive with no isocyanates or solvents.

  2. Excellent adhesion to diverse substrates including metals, plastics, glass, and painted surfaces without priming.

  3. High elasticity and permanent flexibility after curing, maintaining performance across wide temperature ranges (–40 °C to +90 °C).

  4. Low modulus formulation enables stress-relieving bonding for thermally expanding joints and dynamic assemblies.

  5. Good UV and weather resistance, suitable for long-term outdoor exposure in architectural and transportation applications.

Typical Applications Of Wacker GENIOSIL STP-E35 SMP Adhesive

  1. Structural bonding of aluminum composite panels (ACP) and metal façade elements in building envelopes.

  2. Assembly of bus, train, and recreational vehicle (RV) interior components requiring vibration-damping adhesion.

  3. Bonding of insulated glazing spacers and perimeter sealing of curtain wall systems.

  4. Mounting of signage, trim, and decorative cladding on concrete, steel, and fiber-cement substrates.

  5. Adhesive joining of lightweight sandwich panels used in modular construction and prefabricated units.

Specifications Of Wacker GENIOSIL STP-E35 SMP Adhesive

Chemical TypeSilyl-modified polymer (SMP), isocyanate-free
Product FormPaste-like, thixotropic one-component adhesive
AppearanceOff-white to light gray, homogeneous paste
Primary ApplicationsStructural bonding, panel assembly, façade integration
Key FeaturesNo solvents, no isocyanates, primerless adhesion, low modulus
Shelf Life (unopened)12 months at ≤25 °C in original sealed packaging
Curing MechanismMoisture-curing (reacts with ambient humidity)
Recommended Application Temperature+5 °C to +35 °C


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