One-component, moisture-curing silyl-modified polymer (SMP) adhesive with no isocyanates or solvents.
Excellent adhesion to diverse substrates including metals, plastics, glass, and painted surfaces without priming.
High elasticity and permanent flexibility after curing, maintaining performance across wide temperature ranges (–40 °C to +90 °C).
Low modulus formulation enables stress-relieving bonding for thermally expanding joints and dynamic assemblies.
Good UV and weather resistance, suitable for long-term outdoor exposure in architectural and transportation applications.
Structural bonding of aluminum composite panels (ACP) and metal façade elements in building envelopes.
Assembly of bus, train, and recreational vehicle (RV) interior components requiring vibration-damping adhesion.
Bonding of insulated glazing spacers and perimeter sealing of curtain wall systems.
Mounting of signage, trim, and decorative cladding on concrete, steel, and fiber-cement substrates.
Adhesive joining of lightweight sandwich panels used in modular construction and prefabricated units.
| Chemical Type | Silyl-modified polymer (SMP), isocyanate-free |
| Product Form | Paste-like, thixotropic one-component adhesive |
| Appearance | Off-white to light gray, homogeneous paste |
| Primary Applications | Structural bonding, panel assembly, façade integration |
| Key Features | No solvents, no isocyanates, primerless adhesion, low modulus |
| Shelf Life (unopened) | 12 months at ≤25 °C in original sealed packaging |
| Curing Mechanism | Moisture-curing (reacts with ambient humidity) |
| Recommended Application Temperature | +5 °C to +35 °C |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China