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High thermal conductivity (≥1.5 W/m·K) for efficient heat dissipation in electronic assemblies.
Excellent electrical insulation properties with volume resistivity >1×10¹⁴ Ω·cm.
Platinum-catalyzed addition cure system offering low shrinkage and precise dimensional stability.
Self-adhesive to common substrates including aluminum, copper, and FR-4 PCBs without primer.
UL 94 V-0 rated flame retardancy for enhanced safety in demanding environments.
Thermal interface material (TIM) for power electronics and IGBT modules.
Encapsulation and potting of LED drivers and automotive control units.
Gap-filling adhesive for battery module thermal management systems.
Die-attach and underfill in high-power semiconductor packaging.
Thermally conductive bonding in renewable energy inverters and solar charge controllers.
| Chemical Type | Platinum-catalyzed addition-cure silicone rubber |
| Product Form | Two-component liquid system (Part A + Part B) |
| Appearance | Opaque gray paste (Part A), translucent gray paste (Part B) |
| Mixing Ratio (by weight) | 1:1 (A:B) |
| Cure Temperature Range | 25–150 °C (room temperature cure possible with extended time) |
| Shore A Hardness (cured) | 55–65 |
| Primary Applications | Thermal interface materials, encapsulation, bonding, gap filling |
| Key Features | High thermal conductivity, electrically insulating, self-adhesive, flame retardant |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
