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High thermal conductivity for efficient heat dissipation in power electronics.
Excellent electrical insulation properties combined with thermal management capability.
Low modulus and high elasticity ensure stress relief and long-term reliability under thermal cycling.
Platinum-catalyzed, addition-cure chemistry enables precise control over curing and minimal by-products.
Two-component system with simple 1:1 mixing ratio by weight for ease of processing and reproducibility.
Thermal interface material (TIM) between IGBT modules and heat sinks in electric vehicles and inverters.
Encapsulation and potting of power semiconductor devices operating at elevated temperatures.
Gap-filling thermal pads for battery management systems (BMS) and onboard chargers.
Die-attach and underfill applications requiring both thermal conduction and electrical isolation.
| Chemical Type | Platinum-catalyzed addition-cure silicone rubber |
| Product Form | Two-component liquid (Part A and Part B) |
| Appearance | Opaque grey paste (Part A), translucent grey paste (Part B) |
| Mixing Ratio (by weight) | 1 : 1 |
| Shore A Hardness (cured, 7 days @ 23 °C) | ~45 |
| Thermal Conductivity (ASTM D5470) | 2.0 W/(m·K) |
| Density (ISO 2781) | ~2.0 g/cm³ |
| Volume Resistivity (IEC 60093) | >1 × 10¹⁴ Ω·cm |
Contact With Us:
E-mail: wangxingqiang@ericwchem.com
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Building A1, Jiete Industrial Park, Huangpu District, Guangzhou City, Guangdong Province, China
